LEDs with remote phosphor layer and reflective substrate
A phosphor layer and substrate technology, applied in semiconductor devices, electrical solid devices, electrical components, etc., can solve problems such as saturation, high photon density, and difficulties
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[0026] figure 1 A conventional flip-chip LED die 10 mounted on a portion of a substrate wafer 12 is illustrated. In flip chip, n and p contacts are formed on the same side of the LED die.
[0027] LED die 10 is formed from semiconductor epitaxial layers including n-layer 14, active layer 15 and p-layer 16 grown on a growth substrate such as a sapphire substrate. exist figure 1 In , the growth substrate is removed by laser lift-off, etching, grinding, or by other techniques. In one example, the epitaxial layer is GaN-based, and the active layer 15 emits blue light. LED dies that emit UV light are also applicable to the present invention.
[0028] Metal electrode 18 electrically contacts p-layer 16 and metal electrode 20 electrically contacts n-layer 14 . In one example, electrodes 18 and 20 are gold pads ultrasonically welded to anode and cathode metal pads 22 and 23 on ceramic substrate wafer 12 . Substrate wafer 12 has conductive vias 24 to bottom metal pads 26 and 28 f...
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