Energy application device and energy application method

A technology of energy supply and energy, applied in bonding methods, chemical instruments and methods, chemical/physical/physical-chemical processes of applying energy, etc., which can solve problems such as easy peeling, non-hardening and damage of the adhesive layer, etc.

Active Publication Date: 2015-03-18
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, as shown in the ultraviolet irradiation device described in Patent Document 1, in a structure in which only ultraviolet energy is supplied to an adhesive sheet (adhesive tape), the adhesive layer in which the adhesive sheet exists cannot be hardened so that it can be easily peeled off. Defective conditions to the extent that the chip is broken

Method used

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  • Energy application device and energy application method
  • Energy application device and energy application method
  • Energy application device and energy application method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] In Example 1, the adhesive force when the adhesive material layer of the dicing tape was photocured using light of a single wavelength of 365 nm and heat was evaluated.

[0065] First, the dicing tape attached to the stainless steel plate was irradiated with 365 nm single-wavelength light through the same dicing tape sticking step and single-wavelength light irradiation step as in Comparative Example 2.

[0066] Afterwards, utilize the spot heater (model: SH01 / 1100-035K) that Co., Ltd. Bamboo Net Manufacturing Institute (Co., Ltd. Bamboo Net Manufacturing Co., Ltd.) makes to heat the cutting tape (heating step), and use the same method as Comparative Examples 1 and 2. Evaluation Step The adhesive force was evaluated. In addition, samples having different light quantities in the single-wavelength light irradiation step were prepared and evaluated in the same manner.

[0067] Such as Figure 4 As shown, the adhesive force changed between 180 to 260mN / 25mm, and became a ...

Embodiment 2

[0069] In Example 2, the adhesive force when the adhesive material layer of the dicing tape was photocured using light of a single wavelength of 365 nm and high frequency was evaluated.

[0070] First, the dicing tape pasted on the stainless steel plate was irradiated with 365 nm single-wavelength light through the same dicing tape sticking step and single-wavelength light irradiation step as in Comparative Example 2 and Example 1.

[0071] Afterwards, a high-frequency generating device (model: DIHS105-MT1) manufactured by HIDEC Co., Ltd. (Hidec Co., Ltd.) was used to provide high-frequency to the stainless steel plate with the dicing tape attached, and by comparing with Comparative Example 1, Comparative Example 2, and Example 1 Adhesion was evaluated in the same evaluation procedure. In addition, samples having different light quantities in the single-wavelength light irradiation step were prepared and evaluated in the same manner.

[0072] Such as Figure 4 As shown, the ...

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Abstract

An energy application device applies optical energy on an adhesion sheet by a light radiator and, subsequently, applies heat energy on the adhesion sheet by a heater. With this arrangement, even the adhesion sheet, which includes an adhesive layer having an energy barrier that cannot be overcome only with optical energy, is enabled to start a photoreaction by overcoming an energy barrier with the heat energy from the heater.

Description

technical field [0001] The present invention relates to an energy supply device and an energy supply method for causing a photoreactive object to undergo a photoreaction by irradiating light to a photoreactive object to be irradiated. Background technique [0002] In a processing apparatus of a semiconductor wafer (hereinafter simply referred to as a wafer), for example, back grinding is performed by affixing a protective tape to the circuit surface of the wafer, or division into a plurality of chips is performed by affixing a dicing tape. In the tape used in the above-mentioned treatment, a photocurable (photoreactive) adhesive is used. After the above-mentioned treatment, the adhesive is hardened (photoreacted) by irradiating light through the energy supply device, thereby weakening the adhesion. force to easily peel off the wafer without damaging the wafer (for example, refer to Patent Document 1). [0003] In the light-emitting diode mounting part of the ultraviolet irr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J19/12H01L21/301H01L21/304C09J5/00
CPCH01L21/67115H01L21/67132B01J19/123H01L2221/6834
Inventor 河崎仁彦
Owner LINTEC CORP
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