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Energy ray-curable epoxy resin composition having excellent fast curing properties

An energy ray curing, epoxy resin technology, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc. Effect

Active Publication Date: 2012-05-23
KYORITSU KAGAKU SANGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, cation-curable epoxy resins have a problem of slow curing speed

Method used

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  • Energy ray-curable epoxy resin composition having excellent fast curing properties
  • Energy ray-curable epoxy resin composition having excellent fast curing properties
  • Energy ray-curable epoxy resin composition having excellent fast curing properties

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6 and comparative example 1～2

[0047] Based on the ratio shown in Table 1, the photoacid generator PI2074 or CPI-210S was dissolved in 4-butyrolactone, and added to EPICLON 850, stirred until transparent to prepare the energy rays of Comparative Examples 1 and 2 Curable epoxy resin composition.

[0048] Based on the proportions shown in Table 1, OXT-191 was added to the epoxy resin composition of Comparative Example 1 or 2, and stirred until uniform, to prepare the energy ray-curable epoxy resin compositions of Examples 1-6.

[0049] Table 1

[0050]

[0051] EPICLON 850: Bisphenol A type epoxy resin (manufactured by DIC Corporation)

[0052] OXT-191: Oxetanyl silicate (manufactured by Toagosei Co., Ltd.)

[0053] PI2074: Ionium salt-based photoacid generator (manufactured by Rhodia Corporation)

[0054] CPI-210S: Sulphonium-based photoacid generator (manufactured by San-Apro)

[0055] 4-butyrolactone: solvent (manufactured by Wako Pure Chemical Industries, Ltd.)

Embodiment 7～11 and comparative example 3

[0061] Based on the compounding ratio shown in Table 3, the energy-ray-curable epoxy resin composition of Examples 7-11 and the comparative example 3 was prepared.

[0062] table 3

[0063]

[0064] EPICLON 860: Bisphenol A type epoxy resin (manufactured by DIC Corporation)

[0065] OXT-211: 3-ethyl-3-(phenoxymethyl)oxetane (manufactured by Toagosei Co., Ltd.)

[0066] OXT-121: 1,4-bis[{(3-ethyl-3-oxetanyl)methoxy}methyl]benzene (manufactured by Toagosei Co., Ltd.)

[0067] OXT-191: Oxetanyl silicate (manufactured by Toagosei Co., Ltd.)

[0068] PI2074: Ionium salt-based photoacid generator (manufactured by Rhodia Corporation)

[0069] DETX-S: 2,4-diethylthioxanthone (sensitizer: manufactured by Nippon Kayaku Co., Ltd.)

[0070] CPI-210S: Sulphonium-based photoacid generator (manufactured by San-Apro)

[0071] Art Parl GS-350T: Acrylic / styrene copolymer filler (manufactured by Negami Kogyo Co., Ltd.)

[0072] TALC P-2: Talc (manufactured by Japan TALC Company)

Embodiment 12～14

[0082] Based on the compounding ratio shown in Table 6, the energy ray-curable epoxy resin composition of Examples 12-14 was prepared.

[0083] Table 6

[0084]

[0085] X-40-2670: Alicyclic epoxy silicate (manufactured by Shin-Etsu Chemical Co., Ltd.)

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Abstract

Disclosed is an energy ray-curable epoxy resin composition wherein the problem of slow curing has been solved, while maintaining high fixation accuracy. Specifically disclosed is an energy ray-curable epoxy resin composition which contains an epoxy resin, a silicate compound that has a cationically curable functional group, and a photoacid generator.

Description

technical field [0001] The present invention relates to an energy ray-curable epoxy resin composition, and particularly relates to an energy ray-curable epoxy resin composition which can maintain high fixing accuracy and has excellent fast curing properties and is suitable for fixing optical components. Background technique [0002] In an optical pickup device, a photocurable adhesive is used to fix a photodetector to a case (Patent Documents 1 and 2). This adhesive is required to have high fixing accuracy and good curability (rapid cure). [0003] Fixing accuracy refers to the accuracy that shows that the photodetector does not move from a predetermined position when the photodetector is fixed to the case. If the fixing accuracy is low, the photodetector will move from a predetermined position during manufacture of the optical pickup device or after an endurance test, making it impossible to perform light detection. Therefore, high fixing accuracy is required. [0004] T...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/18C08L63/00C09J11/06C09J163/00
CPCC09J163/00C08L63/00C08K5/5435G03F7/0755G03F7/038
Inventor 远山茂树
Owner KYORITSU KAGAKU SANGYO KK
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