Wet treatment device and wet treatment method

Abstract

A wet treatment device retains a substrate to be treated on a stage and rotates the stage, to perform a wet treatment. The substrate to be treated, the center of which is moved away from the rotation center of the stage, is retained in the stage using a Verneuil chuck which blows an inert gas onto the reverse side of the substrate to be treated, so that the substrate to be treated rotates eccentrically in conjunction with the rotation of the stage. A first gas supply route used for the Verneuil chuck is provided in a rotary shaft portion within the stage. Further, in the stage, second gas supply routes which communicate with the first gas supply route to introduce an inert gas onto the reverse side of the substrate to be treated are axisymmetrically placed with respect to the center axis of the substrate to be treated.

Description

technical field [0001] The present invention relates to a wet processing device and a wet processing method for performing wet cleaning and etching with a wet chemical solution on semiconductor substrates and the like. Background technique [0002] Wet processes such as cleaning and etching are indispensable processes in the manufacture of precision substrates such as semiconductor devices. In order to save cleaning fluid and save the floor area of ​​the cleaning device, in recent years, the development of a single-chip wet processing device has been carried out. Most single-wafer wet processing apparatuses have a rotation holding unit that holds the substrate to be processed in a horizontal state and is rotatable. As a method of holding the substrate to be processed, as disclosed in Patent Document 1, a Bernoulli chuck that can hold the substrate to be processed and the rotary table in a non-contact manner and utilizes Bernoulli's theorem is effective. . [0003] The Ber...

AI Technical Summary

Problems solved by technology

[0005] If the wet processing liquid is supplied to the substrate to be processed with a slightly concave central part through the Bernoulli chuck, the wet processing liquid will stay in the central part of the substrate to be processed, especially the problem that the process uniformity in the central part of the substrate to be processed will deteriorate.

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