Through hole type high-heat-radiation light emitting diode (LED) chip and manufacture method thereof

Abstract

The invention provides a structure and a method for manufacturing a through hole type high-heat-radiation light emitting diode (LED) chip. The structure comprises at least one chip and a bottom plate, wherein the chip comprises a substrate and a luminous epitaxial layer grown on the substrate surface, the substrate is provided with a first surface and a second surface opposite to the first surface, a reflecting layer is formed on the second surface of the substrate, a bottom plate with good heat radiation performance is bonded on the reflecting layer formed on the second surface of the substrate through wafers, and the luminous epitaxial layer is formed on the first surface, wherein light emitted by the luminous epitaxial layer comprises light spread in a direction far away from the substrate and light spread in a direction towards the substrate, the light spread in the direction towards the substrate is at least partially transmitted from the substrate and is then reflected by the reflecting layer, partial N type electrodes of the luminous epitaxial layer are connected with the bottom plate through a through hole, and partial N type electrodes are connected with the bottom plate through side walls. The invention also provides the through hole type high-heat-radiation LED chip manufactured by the method.

Description

technical field [0001] The invention relates to making a through-hole type high heat dissipation LED chip and a structure for making the through-hole type high heat dissipation LED chip. Background technique [0002] Since the discovery of LED white light in the 1990s, its luminous efficiency has increased rapidly, breaking through 100lm / W in 2010. It does not require warm-up time, fast response, small size, low power consumption, low pollution, suitable for mass production, high reliability, and a wide range of applications, such as traffic signs, large displays or backlights, mobile phone backlights, Street lighting, etc. LED also has its shortcomings to be overcome. About 20% of the energy input into LED will be converted into light source, and the remaining 80% will be converted into heat energy. Heat generation is a very serious problem. First, when the temperature rises, the luminous intensity will decrease, and Life expectancy will also decrease. An increase in tem...

AI Technical Summary

Problems solved by technology

However, compared with traditional horizontal LEDs, the process of vertical LEDs is cumbersome, and the difference in thermal expansion coefficient and adhesion between the LED chip after removing the sapphire and the substrate after reposting is a hidden danger for the long-term use of high-power LEDs in the future.

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