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Embossed carrier tape and method for manufacturing the same

An embossing and carrier tape technology, applied in transportation and packaging, electrical components, packaging, etc., can solve the problems of difficulty in obtaining transparency, shape accuracy and flexural strength of micro-embossed parts, and achieve good transparency and shape accuracy. and excellent flexural strength

Inactive Publication Date: 2012-05-30
DENKA CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] As a method of molding the above-mentioned sheet, press method, vacuum molding, compressed air molding, rotary vacuum molding, etc. can be mentioned, but any molding method is difficult to obtain the above-mentioned transparency, shape accuracy and bending strength. micro embossed part

Method used

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  • Embossed carrier tape and method for manufacturing the same
  • Embossed carrier tape and method for manufacturing the same
  • Embossed carrier tape and method for manufacturing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0057] In Embodiment 1, a sheet obtained by biaxially stretching a styrene-based resin composition is used.

[0058] Here, the styrenic resin refers to a homopolymer or a copolymer of a styrenic monomer, including, for example, general-type polystyrene resin (hereinafter referred to as "GPPS resin"), impact-resistant polystyrene resin (hereinafter Referred to as "HIPS resin"), various resins such as styrene-conjugated diene block copolymers, styrene-(meth)acrylate copolymers, and mixtures of one or more of them.

[0059] A representative example of the blend of styrenic resin compositions constituting the sheet is a mixture of GPPS resin and HIPS resin, or a mixture further containing a styrene-conjugated diene block copolymer in the mixture.

[0060] The GPPS resin (A) is a resin basically composed of styrene units, and is not particularly limited. In order to maintain the strength and transparency of the embossed carrier tape, its weight-average molecular weight is based on ...

Embodiment approach 2

[0104] Refer below figure 2 as well as image 3 Embodiment 2 of the manufacturing method of the embossed carrier tape of this invention is demonstrated. It should be noted that Embodiment 2 is different from Embodiment 1 mainly in that the embossed portion is formed by rotating the vacuum forming die 9 using the cylindrical heater 8 .

[0105] In addition, in Embodiment 2, the description of the structure which overlaps with Embodiment 1 is abbreviate|omitted.

[0106] The method for producing an embossed carrier tape according to Embodiment 2 uses the same biaxially stretched sheet as in Embodiment 1, and includes: (a) a step of cutting the sheet into tapes; A step of continuously heating the region where the embossed portion is to be formed with a rotating cylindrical heater, and (c) a step of continuously forming the embossed portion in the heated region with a rotating cylindrical rotary vacuum forming mold.

[0107] That is, if figure 2 or image 3 As shown, a tape...

Embodiment 1-10

[0153] In Examples 1-10, resin 1 was used as GPPS resin (A), and resin 2 was used as HIPS resin (B). In addition, select styrene / butadiene mass ratio and resin 3-5 that the molecular weight of styrene segment part is different as the resin containing styrene-butadiene block copolymer (C), according to the matching shown in table 1 Mix them together to make various resin compositions.

[0154]Next, each resin composition was melt-kneaded by an extruder and extruded from a T-die to obtain an unstretched sheet. Next, stretch the unstretched sheet 2.3 times in the longitudinal direction using a longitudinal stretching machine under heating at 90-135°C, and then stretch it in the transverse direction using a transverse stretching machine under heating at 90-135°C. 2.3 times to obtain the biaxially stretched sheets of Examples 1-10.

[0155] Next, the orientation relaxation stress, haze, tensile elastic modulus, sheet impact properties, and folding strength of each of the obtained...

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Abstract

The present invention provides an embossed carrier tape and a method for producing the same. The embossed carrier tape having embossed section that has excellent accuracy of shape and buckling strength. The present invention provides the production method of embossed carrier tape and embossed carrier tape produced by this production method. The production method is containing the following procedures: (a)Procedure of slitting a sheet to tape shape, where in the sheet is obtained by biaxially stretching styrene system resin composition and has an orientation mitigation stress of 0.2-0.8 MPa as measured in accordance with ASTM D-1504. (b)Procedure of heating area of slited tape only, where in the area forms into embossed section. (c)Prodedure of forming embossed section on heated area.

Description

technical field [0001] The present invention relates to an embossed carrier tape for electronic components, and a method for producing the carrier tape. Background technique [0002] Currently, thermoplastic resins such as vinyl chloride resins, styrene resins, polyethylene terephthalate resins, and polycarbonate resins are used as carrier tapes for housing electronic components mounted on electronic equipment. An embossed carrier tape obtained by thermoforming the formed sheet into an embossed shape. [0003] In such an embossed carrier tape, measures must be taken to prevent electrostatic damage to electronic components. For example, when used for electronic components such as ICs and LSIs that require high antistatic properties, use a sheet composed of a resin composition containing a conductive filler such as carbon black in the above-mentioned thermoplastic resin, and coat the surface of the above-mentioned resin sheet. Sheets obtained by spreading conductive paint, e...

Claims

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Application Information

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IPC IPC(8): B65D73/02B65D85/86
CPCB29C51/082B29C51/421H05K13/0084C08J5/18B29C35/0266B29C59/02B29B13/023B29C51/225B29C51/08B29C59/04Y10T428/24628Y10T428/24669
Inventor 武井淳笹川武信广川裕志波津久贵
Owner DENKA CO LTD
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