Degumming technology for aqueous solution of methanesulfonic acid

Abstract

The invention discloses a degumming technology for the aqueous solution of methanesulfonic acid. The technology comprises the following steps of: a, adding a certain amount of water into an acid soaking tank of a degumming machine, setting the heating temperature, and turning on a switch for heating; b, adding a certain amount of methanesulfonic acid with a prepared concentration into the acid soaking tank of the degumming machine; c, putting a silicon wafer after flushing and ultrasonic washing and a cutting substrate together into the acid soaking tank to soak for some time; and d, lifting the cutting substrate by a special tool, and taking down a few silicon wafers which do not drop. The technology adopts the aqueous solution of methanesulfonic acid in the acid soaking process, has the advantages of sufficient silicon wafer separation and low cost, can shorten the degumming time and does not produce gas with irritant odor.

Description

Technical field [0001] The invention relates to a process for degumming single and polycrystalline silicon wafers, in particular to a process for degumming single and polycrystalline silicon wafers by using an aqueous solution of methanesulfonic acid. Background technique [0002] Monocrystalline silicon and polycrystalline silicon play an important role in the field of solar cells. In the production process, the silicon material needs to be cut by multiple wires. First, the monocrystalline silicon rod or polycrystalline silicon ingot is bonded to the glass plate or resin plate base through epoxy resin. On the material, after the monocrystalline silicon rod or polycrystalline silicon ingot is cut, the cutting jig, the cutting substrate and the completed silicon wafer are transferred to the degumming machine with special tools for washing and degumming. Generally, there are three steps: washing , Ultrasonic washing and acid immersion degumming, there are the following shortcomings...

AI Technical Summary

Problems solved by technology

[0002] Monocrystalline silicon and polycrystalline silicon play an important role in the field of solar cells. During the production process, the silicon material needs to be cut in multiple lines. First, the monocrystalline silicon rod or polycrystalline silicon ingot is bonded to the glass plate or resin plate base by epoxy resin. On the material, after the monocrystalline silicon rod or polycrystalline silicon ingot is cut, the cutting fixture, the cutting substrate and the cut silicon wafer are transferred to the degumming machine with special tools for rinsing and degumming. Generally, it is divided into three steps: washing 1. Ultrasonic cleaning and acid immersion degumming have the following disadvantages in the acid immersion process: (1), silicon wafers cannot be fully detached, and the degumming time is longer. When the prepared lactic acid concentration is 10% to 60%, the temperature is 30 ° C to The immersion time is 200-600 seconds at 75°C, which is relatively long; (2) the adhesive strip is too detached, and the adhesive strip is caught in the middle of the silicon wafer after falling off, which is difficult to clean; (3) lactic acid degumming or citric acid degumming A pungent smell will be produced during the process; (4) The cost of degumming is relatively high. Taking the DS271 model as an example, the lactic acid used for single-pole degumming is about 2.0kg, and the cost is about 20-25 yuan, which is relatively high

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