White covering film for flexible circuit board as well as preparation method and application for same

A flexible circuit board and cover film technology, which is applied in chemical instruments and methods, synthetic resin layered products, lamination devices, etc., can solve the problem that the ink surface is prone to cracks, it is difficult to meet the requirements of UL94V-0, and the surface brightness is easily affected by the environment. Influence and other issues, to achieve the effect of good surface brightness and reflectivity, excellent long-term weather resistance, and excellent yellowing resistance

Inactive Publication Date: 2012-06-20
欣兴同泰科技(昆山)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the existing production process, white ink needs to be used as the reflective layer of the backlight module in the backlight or light strip products, but because it is used for silk printing after the circuit and cover film, there are the following defects and deficiencies: due to the different thickness of the board surface, There are many surface defects and poor yield; after screen printing white ink, it needs to be baked at low temperature twice, which increases the process and consumes man-hours; it is easy to yellow, and the whiteness is easy to change; it is not resistant to bending, and the ink surface is prone to cracks ; The surface brightness is easily affected by the environment, and the reflectivity is poor; the flame resistance is not good, and it is difficult to meet the requirements of UL 94V-0; the long-term weather resistance is poor

Method used

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  • White covering film for flexible circuit board as well as preparation method and application for same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The method of preparing white cover film: Coat a 25um adhesive layer on a polyimide layer with a thickness of 25um, then attach a release paper layer, and then coat the other side of the polyimide layer with a thickness of 13um White ink layer. Among them, the polyimide layer adopts soluble polyimide with a number average molecular weight of 100,000, the adhesive adopts modified epoxy resin adhesive of HF Epoxy brand produced by Taihong Company, and the white ink adopts the product of DPR-55 brand of Asahi Company.

Embodiment 2

[0024] The method of preparing white cover film: Coat a 25um adhesive layer on a polyimide layer with a thickness of 25um, then attach a release paper layer, and then coat the other side of the polyimide layer with a thickness of 20um White ink layer. Among them, the polyimide layer adopts soluble polyimide with a number average molecular weight of 100,000, the adhesive adopts modified epoxy resin adhesive of HF Epoxy brand produced by Taihong Company, and the white ink adopts the product of DPR-55 brand of Asahi Company.

Embodiment 3

[0030] The method for preparing flexible circuit boards: tear off the bottom release paper of the white cover film prepared in Example 1, and heat the adhesive layer of the white cover film to the pre-treatment (that is, it has been cut and drilled). Hole, copper-plated and etched conductive layer) on the flexible copper clad board, the bonding temperature is 80℃, the pressure is 18 kg / cm2; then it is pressed with a hot press, the pressing temperature is 175℃, the pressure is 160 kg / cm, and the The heating time is 30s, and the pressing time is 5000s; the final baking is at 150°C for 2 hours.

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Abstract

The invention provides a white covering film for a flexible circuit board, comprising an outmost white ink layer, a middle polyimide layer, an inner adhesive layer and release paper on a bottom layer. The invention further provides a method for preparing a flexible circuit board by using the white covering film, comprising the following steps of: removing the release paper on the bottom layer of the white covering film, thermally bonding the adhesive layer of the white covering film on a pre-treated flexible copper-clad plate primarily, pressing-fitting by a hot press, and finally roasting. The flexible circuit board prepared by using the white covering film provided by the invention is good in smoothness, remarkably increased in the reflecting brightness of LED (light-emitting diode), excellent in anti-yellowing characteristic, great in flexibility, as well as good in surface brightness and reflectivity.

Description

Technical field [0001] The invention relates to a white covering film for a flexible circuit board and a preparation method of the white covering film. The invention also relates to a manufacturing method of the flexible circuit board. Background technique [0002] Flexible printed circuit (Flexible Printed Circuit, FPC for short) is a printed circuit made of a flexible insulating substrate and has many advantages that a rigid printed circuit board does not possess. For example, it can be freely bent, wound, and folded, can be arranged arbitrarily according to the space layout requirements, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC can greatly reduce the volume of electronic products, and is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/06B32B27/10B32B27/28B32B7/12B32B37/06B32B37/10B32B38/16
Inventor 穆俊杰钱令习赵小爱
Owner 欣兴同泰科技(昆山)有限公司
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