Liquid crystal epoxy resin with shape memory effect and preparation method and application thereof
A technology of epoxy resin and memory effect, applied in the field of material engineering, can solve problems such as poor mechanical properties and thermal properties, and achieve the effects of low cost, short thermal response time, and convenient adjustment
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Embodiment 1
[0037] A liquid crystal epoxy shape memory material prepared by the following method:
[0038] Heat and melt 100 parts of epoxy resin biphenol diglycidyl ether at 175°C, then add 20 parts of n-octylamine, mix well, and finally add 15 parts of 4,4'-diaminodiphenylmethane, melt and mix well ; Pour the resulting mixture into a preheated mold at 155°C, solidify at 170°C for 4 hours, then cure at 200°C for 2 hours, and then cool to 20°C to obtain a liquid crystal epoxy shape memory material;
[0039] Said parts are parts by weight.
[0040] The thermal response temperature of the liquid crystal epoxy shape memory material prepared in this embodiment is 90-140°C.
Embodiment 2
[0042] A liquid crystal epoxy shape memory material prepared by the following method:
[0043] Heat and melt 100 parts of epoxy resin (composed of bisphenol diglycidyl ether and bisphenol A epoxy resin E-51 in a mass ratio of 1:2) at 16°C, and then add 1.22 parts of monohydric aliphatic amine Ethylamine, mix well, and finally add 16 parts of 4,4'-diaminodiphenylmethane, melt and mix; pour the resulting mixture into a preheated mold at 140°C, solidify at 40°C for 8 hours, and then Curing for 0.5 hours, then cooling to 25°C to obtain a liquid crystal epoxy shape memory material;
[0044] Said parts are parts by weight.
[0045] The thermal response temperature range of the shape memory of the liquid crystal epoxy shape memory material prepared in this embodiment is 80-140°C.
Embodiment 3
[0047] A liquid crystal epoxy shape memory material prepared by the following method:
[0048] Heat and melt 100 parts of biphenol diglycidyl ether at 190°C, then add 42.59 parts of monohydric aliphatic amine n-hexadecylamine, mix well, and finally add 20 parts of 4,4'-diaminodiphenylmethane, Melting and mixing; pour the resulting mixture into a preheated mold at 170°C, solidify at 100°C for 6 hours, then solidify at 210°C for 1 hour, and then cool to 30°C to obtain a liquid crystal epoxy shape memory material;
[0049] Said parts are parts by weight.
[0050] The thermal response temperature range of the shape memory of the liquid crystal epoxy shape memory material prepared in this embodiment is 70-120°C.
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