Halogen-free low dielectric resin composition and prepreg and copper clad laminate made of same

Abstract

The invention relates to a halogen-free low dielectric resin composition and a prepreg and copper clad laminate made of the same. The halogen-free low dielectric resin composition comprises the following components in part by weight of organic solid content: 5 to 90 parts by weight of epoxidized polybutadiene resin, 10 to 90 parts by weight of benzoxazine resin, 10 to 90 parts by weight of epoxy resin, 1 to 50 parts by weight of curing agent, 10 to 50 parts by weight of organic flame retardant, 0.001 to 1 part by weight of curing accelerator, 0.1 to 10 parts by weight of initiator and 10 to 100 parts by weight of fillings. Due to the adoption of the epoxidized polybutadiene in the halogen-free low dielectric resin composition disclosed by the invention, not only are the defects of polybutadiene improved, but also the advantages on the aspects of dielectric and flexibility are well kept and the adhesion force between the halogen-free low dielectric resin composition and a copper foil is improved; and the prepreg and copper clad laminate for a printed circuit board, which is made of the resin composition, has excellent dielectric performance, good heat resistance and high glass transition temperature and the requirements on the high frequency of transmission of an electronic signal and high speed of information processing in the industry of the printed circuit copper clad laminate can be met.

Description

technical field [0001] The invention relates to a resin composition, in particular to a halogen-free low-dielectric resin composition and a prepreg for printed circuit and a copper-clad laminate made using it. Background technique [0002] For high-speed and high-frequency signal transmission in printed circuit boards, the smaller the signal attenuation, the better it is to obtain a more complete signal. In recent years, with the rapid development of the information industry, the demand for low-dielectric copper-clad laminates has further increased, and the plates are required to have a lower dielectric constant and a smaller dielectric loss. The dielectric constant (Dk) of ordinary FR-4 at 1GHz is 4.3-4.8, and its dielectric loss (Df) is 0.02-0.025; the Dk at 1MHz is 4.5-5.0, and its dielectric loss (Df) 0.015-0.02, therefore, ordinary FR-4 cannot meet the speed of high-frequency signal transmission and the integrity of signal transmission. [0003] There are many ways to...

AI Technical Summary

Problems solved by technology

Chinese patent 200710162020.9 reports that 1,2-polybutadiene is prepared under the action of step-by-step free radical polymerization of low temperature and high temperature initiators DK2.5, DF0.0015 of resin plate, DK3.2 of laminated plate, DF0. 0024, but polybutadiene will observe exudation in the laminate, its glass transition temperature and heat resistance are low, its adhesion to copper foil is poor, and its solvent resistance is average

Images