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Near-end crosstalk improvement method for backplane connector

A backplane connector and near-end crosstalk technology, which is applied to the parts, connections, and fixed connections of connecting devices, can solve problems such as insufficient effect, and achieve the effect of reducing near-end crosstalk and improving reliability.

Inactive Publication Date: 2013-10-09
GELIPU ELECTRONICS SHENZHEN CITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Aiming at the above-mentioned shortcoming that the crosstalk elimination effect of the backplane connector in the prior art is not good enough, the present invention provides a new method for improving the near-end crosstalk of the backplane connector, which adopts a special terminal arrangement, effectively Improved near-end crosstalk for backplane connectors

Method used

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  • Near-end crosstalk improvement method for backplane connector
  • Near-end crosstalk improvement method for backplane connector
  • Near-end crosstalk improvement method for backplane connector

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Embodiment Construction

[0033] This embodiment is a preferred implementation mode of the present invention, and other principles and basic structures that are the same or similar to this embodiment are within the protection scope of the present invention.

[0034] Please see attached Figure 4 , the present invention is a method for improving near-end crosstalk of a backplane connector. The structure of the backplane connector adopting the method of the present invention is that multiple rows of terminal rows are arranged on the insulating base 7, and each row of terminal rows is arranged in parallel, and each row of terminals A row includes more than one signal terminal, and the present invention mainly improves the near-end crosstalk of the connector by changing the arrangement of the signal terminals in a row of signal terminal rows. In the present invention, more than one signal terminal is arranged side by side, and each signal terminal includes a backplane connection part 8, an insertion part 9...

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Abstract

The invention discloses a near-end crosstalk improvement method for a backplane connector, comprising the following steps that more than one signal terminals is arranged side by side, each signal terminal comprises a backplane connecting part, a splicing part and a middle connecting part, the backplane connecting part and the splicing part are arranged vertical to each other, a first signal terminal extends out from the splicing part, is bended downwards with a certain angle, upwarps upwards and then is bended downwards so as to form the backplane connecting part which is vertical to the splicing part, and all the signal terminals behind a second signal terminal extend out from the respective splicing part, are bended downwards with a certain angle and then are bended downwards again so as to form the respective backplane connecting part which is vertical to the respective splicing part. With the adoption of a contact part of the backplane connector, the structure of the backplane connector is optimized and improved; and with simulation analysis of professional software, near-end crosstalk of the backplane connector in a high-speed signal circuit is effectively lowered, and the reliability that a product transfer signals with high speed is greatly improved.

Description

technical field [0001] The invention discloses a method for improving crosstalk, in particular a method for improving near-end crosstalk of a backplane connector. Background technique [0002] In today's rapidly developing electronic design field, high speed and miniaturization have become an inevitable trend. At the same time, in the circuit design process, the signal frequency increases, the edge of the signal change becomes steeper, the size of the circuit board decreases, the wiring density increases, and the board thickness decreases due to the increase in the number of circuit board layers. It will cause various interference problems. Among all signal integrity problems, crosstalk phenomena and effects are very common. Crosstalk may appear inside the chip, or on the circuit board, connectors, chip packages, and cables. Excessive crosstalk may cause false triggering of the circuit, resulting in serious phenomena such as system failure. Therefore, when designi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/02H01R13/6461H01R12/55
Inventor 吴明泽
Owner GELIPU ELECTRONICS SHENZHEN CITY
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