Extrusion riveting process and mold for edge of central processing unit (CPU) heat conduction assembly

Abstract

The invention discloses an extrusion riveting process and an extrusion riveting mold for an edge of a central processing unit (CPU) heat conduction assembly. The process comprises the following steps of: forming a certain gap between a copper block and a heat dissipation base in a matched mode; extruding an edge material of a base window by using an extrusion mold to ensure that the edge material is extruded towards the copper block; and forming the assembly after the edge extrusion. The riveting mold comprises an upper die base, a lower die base and a stripper plate, wherein a lower die insert and a lower die core are arranged in a lower template; an upper die insert and a stripper plate core are arranged in the stripper plate; an upper die punch is arranged on an upper clamp plate; the lower end of the lower die insert is fixed on the lower template, and the upper end of the lower die insert is provided with a bulge; sliding slots are formed on the two sides of the bulge; and lower die reinforcing ribs are arranged at the periphery of the sliding slots. By the process and the mold, the quality stability and the production efficiency of products are improved, and the riveting retention force between the copper block and the base is greatly increased; the process and the mold have the advantages of high efficiency, stable quality, high retention force and low cost; the surface smoothness of the copper block can be ensured; and the process and the mold have a wide application range and are particularly suitable for small-sized material parts.

Description

technical field [0001] The invention relates to an edge extrusion riveting process of a CPU heat conduction assembly and a riveting mold thereof. Background technique [0002] The heat sink is a device for cooling the heat-prone electronic components in electrical appliances. It is mostly made of aluminum alloy, brass or bronze into plates, sheets, and multi-sheets. For example, the CPU central processing unit in a computer needs to use a large the heat sink. At present, CPU heat conduction assemblies are widely used in the industry, especially NB-type independent graphics card heat dissipation modules. The CPU heat conduction assembly is composed of a heat dissipation base and a copper block. The copper block is fixed on the heat dissipation base. The existing combination The methods are generally divided into soldering riveting, bump riveting and rivet riveting; the soldering riveting is to fix them together by welding, and the combination method has high soldering cost, ...

AI Technical Summary

Problems solved by technology

At present, CPU heat conduction assemblies are widely used in the industry, especially NB-type independent graphics card heat dissipation modules. The CPU heat conduction assembly is composed of a heat dissipation base and a copper block. The copper block is fixed on the heat dissipation base. The existing combination The methods are generally divided into soldering riveting, bump riveting and rivet riveting; the soldering riveting is to fix them together by welding, and the combination method has high soldering cost, low holding force, and low holding force. there is a risk of bad

For bump riveting, the copper block is placed on the base, and the initial gap between them is kept at 0.3mm, and then the strong pressure rib is placed at 0.5*0.2mm, and the base is squeezed by the lathe punch, and the base squeezes the copper block; but this method Deposits can only be made for larger size parts and there is a risk of poor retention and imperfect appearance

In addition, it is the rivet riveting method, which is 0.05mm on one side of the initial gap between the hole of the cooling base and the bump of the copper block; the limit post of the lower die of the stamping die prevents the sinking of the bump when riveting; the punch presses the bump so that the Its material expands toward the base hole; and this has the defects of low efficiency, high cost, limited range of use and imperfect appearance

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