Epoxy resin with modified organic silicon

Abstract

The invention provides epoxy resin with modified organic silicon. The main purpose by using organic silicon for modification is to increase toughness and reduce internal stress of the epoxy resin. Toughening effect of the epoxy resin with organic silicon added in depends on phase domain size and distribution of a second phase in an epoxy resin system, and further self features, system solidifying conditions and the like are important factors affecting the toughening effect. In order to obtain the optimum toughening effect, two standards should be met: toughening agent or modifying agent initially can be dissolved in the resin and precipitates to form dispersed phase particles before gel coagulating; and resin matrix should have high-degree plastic ductility, and cross-linking density, rigidity of curing agent, functionality degree and the modifying agent should be appropriate. In addition, forming of a cross-linked structure of the epoxy resin is affected by various factors and determines performance of cured matters. The cross-linking density is a most frequently-used parameter for indicating physical performance of the modified resin, the toughening effect is directly related with the cross-linking density, and the higher the cross-linking density of the epoxy resin is, the higher glass transition temperature is and the larger the toughening difficulty is.

Description

technical field [0001] The invention relates to an epoxy resin, especially an organosilicon-modified epoxy resin. Background technique [0002] At present, epoxy resin and silicone resin are very important resin varieties. Epoxy resin has excellent mechanical properties, electrical properties, adhesive properties, heat resistance, solvent resistance, and has good formability and low cost. It is widely used in many industries such as plastics industry, coating industry, chemical industry, national defense, etc. field. Epoxy resin is a kind of polymer with cross-linked network structure, although it has good mechanical properties, electrical properties and adhesive properties. But its biggest weakness is that it is brittle after curing, and its impact resistance and stress cracking ability are poor. In recent years, the high performance of structural adhesive materials, semiconductor packaging materials, fiber reinforced materials, laminates, integrated circuits and other m...

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Problems solved by technology

But there are also disadvantages such as poor mechanical pro