Tension control system and control method for multi-wire cutting of silicon wafer

Abstract

The invention relates to a tension control system and a control method for multi-wire cutting of silicon wafer. The system comprises a tension detecting and controlling device and a tension regulating device, wherein the tension detecting and controlling device comprises a tension detecting and controlling main unit, left and right tension detecting devices, a paying-off signal terminal and a takeup signal terminal; the tension detecting and controlling main unit is composed of a main control computer and an analog quantity I/O (Input/Output) acquiring card; the left and right tension detecting devices, the paying-off signal terminal and the takeup signal terminal are connected with the detecting and controlling main unit. The tension control method for the multi-wire cutting of the silicon wafer performs detecting and controlling by adopting the tension control system for the multi-wire cutting and comprises the steps of: applying signal voltage to the signal terminals of a takeup pulley and a paying-off pulley; detecting that whether the tension signal is up to a set tension value or not, if not, returning to the first step; starting the pulley to rotate if the tension is up to the set value; and detecting the changes of the tension signal and driving the tension regulating unit to carry out the tension regulation at the same time. The system and the method disclosed by the invention have the advantages that: through the programmed control by a computer, the tension fluctuation of the cutting wire is decreased and the accuracy and the reliability of the tension control of the multi-wire cutting are greatly increased.

Description

technical field [0001] The invention belongs to the technical field of measurement and control, and relates to the detection and control of silicon wafer cutting technology using computer technology, in particular to a tension control device and a control method on silicon wafer multi-wire cutting equipment. Background technique [0002] The multi-wire cutting machine has the function of cutting solar silicon wafers in batches and in multiple pieces, and is suitable for batch cutting production of 125×125mm solar monocrystalline silicon wafers. With the rapid development of silicon wafer cutting technology, the requirements for cutting quality of silicon wafer are getting higher and higher. Cutting line marks to reduce the breakage rate of subsequent cleaning and printing. Since the multi-wire cutting machine is for batch cutting, the broken wire during the cutting process will cause a lot of damage to the silicon wafer or produce obvious line marks. Therefore, the develo...

AI Technical Summary

Problems solved by technology

Both theoretical verification and actual use have shown that this control method cannot reduce the tension fluctuation range at high linear speeds, and the acceleration is also restricted by the control accuracy and cannot be improved.

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