Method and device for removing cut oxidation films of 8-inch wafers
A technology for oxide film removal and oxide film application in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., which can solve problems such as high cost of equipment and raw materials, impact on the quality of the epitaxial layer, inability to remove the oxide film by cutting, etc.
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Embodiment 1
[0024] see Figure 1-Figure 6 As shown in the figure, the method for removing the oxide film of the 8-inch wafer incision of the present invention includes the following steps: firstly, the device is turned on to exhaust air; Cover the tank with nitrogen protective cover; turn on the motor to drive the lift tank to move upward from the HF acid tank at a rate of 4-6mm / s; stop the movement until the corrosion block is in close contact with the incision, and the reaction time is 10-15s; start the motor, drive the The lift tank is returned to the HF acid tank at a speed of 4-6mm / s; the nitrogen protective cover is opened, the film cassette is taken out, and the removal of the oxide film of the incision is checked. A total of 100 pieces were processed, and the condition of the incision was checked, and the removal was about 0.6mm, which was uniform and could meet the processing requirements.
Embodiment 2
[0026] see Figure 1-Figure 6 As shown in the figure, the method for removing the oxide film of the 8-inch wafer incision of the present invention includes the following steps: firstly, the device is turned on to exhaust air; Cover the tank with nitrogen protective cover; turn on the motor to drive the lift tank to move upward from the HF acid tank at a rate of 6-10mm / s; stop the movement until the corrosion block is in close contact with the incision, and the reaction time is 15-30s; start the motor, drive the The lift tank returns to the HF acid tank at a speed of 6-10mm / s; open the nitrogen protective cover, take out the film box, and then cooperate with the edge oxide film removal device to remove the edge, process a total of 200 pieces, check the fit of the incision and the edge, and remove the edge The width is exactly the same as the incision, and it is uniform, which fully meets the requirements of IC processing.
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