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Method for chemical nickel-plating and gold immersion on FPC (Flexible Printed Circuit)

A technology of electroless nickel plating and immersion gold, applied in liquid chemical plating, metal processing equipment, metal material coating technology and other directions, can solve the problems of large difference in gold layer thickness, high cost, inconvenient welding, etc., and achieve strong market competition strength, good reliability and appearance quality

Active Publication Date: 2012-07-18
SHENZHEN KINWONG ELECTRONICS
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Problems solved by technology

[0007] The purpose of the present invention is to provide a method for FPC chemical nickel-plating immersion gold, to solve the FPC one-time immersion gold in the prior art due to the different deposition rates of large and small pads, the difference in gold layer thickness is too large, resulting in inconvenient welding or high cost problem

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  • Method for chemical nickel-plating and gold immersion on FPC (Flexible Printed Circuit)
  • Method for chemical nickel-plating and gold immersion on FPC (Flexible Printed Circuit)

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Embodiment Construction

[0023] In order to make the object, technical solution and effect of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples.

[0024] see figure 1 , figure 1 It is a flow chart of the method for FPC electroless nickel plating immersion gold of the present invention. As shown in the figure, the method for the FPC electroless nickel plating immersion gold includes the following steps:

[0025] S1. Immerse the FPC in a nickel tank and a gold tank, and perform the first nickel immersion gold plating treatment on the FPC;

[0026] S2. Take out the FPC, and cover the non-immersion gold area or the pad whose gold layer thickness meets the requirements with a dry film;

[0027] S3, developing the FPC covered with the dry film;

[0028] S4. Then immerse the treated FPC in a gold bath for the second immersion gold treatment, and adjust the time of immersion gold according...

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Abstract

The invention discloses a method for chemical nickel-plating and gold immersion on an FPC (Flexible Printed Circuit). The method has the benefits that preliminary treatment is first conducted through first nick plating and gold immersion, then a bonding pad which doesn't require secondary nick plating and gold immersion, or an area which is free of gold immersion is covered with a dry film, and after development, secondary gold immersion treatment is conducted, so as to meet the requirement for thick gold, ensure the gold thickness required by welding at a small bonding pad, and achieve favorable reliability and appearance quality, and strong market competitiveness.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a method for FPC electroless nickel plating and immersion gold. Background technique [0002] FPC (Flexible Printed Circuit flexible circuit board) is the most complex and versatile type of printed circuit board products. Especially because of its light and thin, flexible, low voltage, low power consumption and other characteristics, it is widely used in electronic products such as notebook computers, liquid crystal displays, hard disks, and printers. [0003] Nickel-gold electroplating is to plate a layer of nickel on the surface conductor of the FPC and then plate a layer of gold. It can achieve good electrical properties during the long-term use of the PCB. In addition, it also has environmental tolerance that other surface treatment processes do not have. The reason for the nickel plating is that the nickel layer prevents the diffusion between gold and copper...

Claims

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Application Information

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IPC IPC(8): C23C18/31C23C18/06B23K1/20
Inventor 黄贤权周正悟
Owner SHENZHEN KINWONG ELECTRONICS
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