Beam-film four-land structured micro-pressure high-overload sensor chip

Abstract

The invention provides a beam-film four-land structured micro-pressure high-overload sensor chip comprising a silicon substrate, wherein four mass blocks, four single beams and a cross beam are processed on the silicon substrate. The mass blocks are connected with the silicon substrate through the single beams, and are interconnected by virtue of the cross beam; a film is arranged in a space defined by the silicon substrate, the mass blocks, the single beams and the cross beam; the back of the silicon substrate is bonded with Pyrex7740 glass; the backs of the mass blocks are thinned, so that a gap is reserved between the mass blocks and the Pyrex7740 glass, and simultaneously, four anti-adsorption electrodes on the Pyrex7740 glass are inserted into the bonding area; a cavity formed between the film, the mass blocks and the Pyrex7740 glass is vacuumized; four piezoresistor bars are interconnected to form a semi-open loop Wheatstone bridge on the front of the silicon substrate; the whole rigidity is improved by using the four single beams and the cross beam; the stress is concentrated again; and the beam-film four-land structured micro-pressure high-overload sensor chip has the characteristics of high sensitivity and linearity, and simultaneously can resist 500 times of high overload.

Description

technical field [0001] The invention relates to the technical field of MEMS piezoresistive absolute pressure sensors, in particular to a beam-membrane four-island structure micro-pressure high overload sensor chip. Background technique [0002] With the development of micro-mechanical electronic system technology, MEMS micro-pressure sensors have been widely used in wind tunnel testing, biomedical electronics, petrochemical and other fields, especially in aerospace, which has strict requirements on sensor volume and weight. MEMS Sensors are undoubtedly the ideal choice. [0003] With the development of aerospace technology, my country's current MEMS micro-pressure sensors are still mainly at the KPa level, which cannot meet the needs of the aerospace field for Pa-level micro-pressure measurement, nor can it adapt to the working environment of the aerospace field, and cannot meet the needs of the aerospace field. The demand for precise measurement technology of deep and high-...

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Problems solved by technology

[0003] With the development of aerospace technology, my country's current MEMS micro-pressure sensors are still mainly at the KPa level, which cannot meet the needs of the aerospace field for Pa-level micro-pressure measurement, nor can it adapt to the working environment of the aerospace field, and cannot meet the needs of the aerospace field. Requirements for precise measurement technology of deep and high-altitude micro-pressure

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