Reflow sn plated member
一种构件、基材的技术，应用在回焊镀Sn构件领域，能够解决焊料湿润性、接触电阻劣化、接触电阻劣化等问题，达到降低插拔力、抑制晶须产生的效果
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Embodiment 1
[0051] On one side of the base material (Cu-1.6%Ni-0.4%Si alloy with a plate thickness of 0.3 mm), Cu plating with a thickness of 0.5 μm and Sn plating with a thickness of 1.0 μm were respectively performed by electroplating under the conditions shown in Table 1. Reflow processing to obtain reflow Sn-plated components.
[0052] As the Cu plating bath, a copper sulfate bath with a sulfuric acid concentration of 60 g / L, a copper sulfate concentration of 200 g / L, and a bath temperature of 50° C. was used, and silica gel ("Snowtex O" manufactured by Nissan Chemical Industries, Ltd.) was added at the ratio shown in Table 1. , specific gravity: 1.12, and silica content rate 20wt%, silica particle size: 10-20 nm) and / or chloride ion (potassium chloride). Set the current density of Cu plating to 5 A / dm 2 , while agitating the plating bath with a stirring blade whose rotation speed was 200 rpm, plating was performed.
[0053] The Sn plating bath used a bath of 80 g / L of methanesulfon...
Embodiment 2
[0074] After performing Ni plating with a thickness of 0.3 μm by electroplating on one surface of the base material, Cu plating with a thickness of 0.5 μm and Sn plating with a thickness of 1.0 μm were respectively performed in the same manner as in Example 1. Thereafter, reflow treatment was performed under the conditions shown in Table 2 to obtain reflow Sn-plated members.
[0075] As the Ni plating bath, nickel sulfate: 250 g / L, nickel chloride: 45 g / L, boric acid: 30 g / L, and a bath temperature of 50° C. were used. Set the current density of Ni plating to 5 A / dm 2 , while agitating the plating bath with a stirring blade at a rotation speed of 200 rpm, plating was performed.
Embodiment 3
[0077] Ni plating, Cu plating, and Sn plating were performed in the same manner as in Example 1 and Example 2, respectively, except that the thicknesses of Ni plating, Cu plating, and Sn plating were changed as shown in Table 3. Thereafter, a reflow treatment was performed under the condition of 550° C. × 15 sec to obtain a reflow Sn-plated member. As a Cu plating bath, a sulfuric acid concentration of 60 g / L, a copper sulfate concentration of 200 g / L, and a copper sulfate bath of 50° C. were used, and further, 15 mL / L of silica gel (manufactured by Nissan Chemical Industry Co., Ltd. “Snowtex O”) was added (expressed as specific gravity: 1.12g / m 3 And the silica content rate is 20wt% of the volume of silica gel, silica particle size: 10-20 nm) and chloride ion (potassium chloride) 25mg / L. Set the current density of Cu plating to 5A / dm 2 , while agitating the plating bath with a stirring blade at a rotation speed of 200 rpm, plating was performed.
[0078] The obtained resul...
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