A kind of manufacturing method of high thermal conductivity aluminum-based copper-clad laminate
A technology of aluminum-based copper-clad laminates and manufacturing methods, applied in chemical instruments and methods, lamination auxiliary operations, non-polymer adhesive additives, etc., can solve problems such as high prices, improve thermal conductivity, and reduce use costs , The effect of reducing the thermal resistance of the plate
Inactive Publication Date: 2015-09-09
陕西泰信电子科技股份有限公司
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[0004] At present, foreign countries mainly produce high thermal conductivity aluminum-based copper-clad laminates mainly by American bergquist, Japanese NRK, DENKA, Sumitomo Electric and other enterprises. The thermal conductivity is basically between 1.5W / mk-2.0W / mk, and American bergquist reports that Sheets with a thermal conductivity of 2.2W / mk, but quite expensive
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[0011] Below in conjunction with embodiment the present invention is described in further detail:
[0012] The production method of the present invention is (1) aluminum plate treatment: first, the aluminum plate is cut into a certain size, the oil stain on the surface is removed with gasoline, washed with water, and dried; the surface of the aluminum plate is roughened with a roughening solution; Carry out oxidation treatment to its surface, wash and dry to make ready-for-use aluminum plate; (2) Synthesis of high thermal conductivity resin: take epoxy resin A-80: 60-80, epoxy resin E-51: 20-27 by weight , 3,3'-dichloro-4,4'-diaminodiphenylmethane 20-27, aluminum nitride 280-370, nitrile rubber 12-36, acetone 20-27, dimethylformamide 7- 9. Treat the filler aluminum nitride with 5% coupling agent KH-550 acetone solution, bake and dry for later use, add epoxy resin A-80:60-80, epoxy resin E-51:20-27 in sequence , 3,3'-dichloro-4,4'-diaminodiphenylmethane 20-27, nitrile rubber 1...
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The invention relates to a method for manufacturing copper clad plate materials, in particular to a method for manufacturing a high-thermal-conductivity aluminum-based copper clad plate. The method includes steps of: firstly processing an aluminum plate; then synthesizing high-thermal-conductivity resin through epoxy resin (A-80), epoxy resin (E-51), marc, aluminum nitride, chemigum, acetone and dimethylformamide; evenly coating the synthesized high-thermal-conductivity resin on a copper foil; and finally placing the glue coated copper foil and the processed aluminum plate together into a hot press for compression moulding. The method for manufacturing the high-thermal-conductivity aluminum-based copper clad plate has the advantages of improving the heat conductivity of domestic high-thermal-conductivity aluminum-based copper clad plates, reducing thermal resistance of the sheets, and accordingly greatly reducing using cost of the high-thermal-conductivity aluminum-based copper clad plates used by domestic enterprises, wherein the thermal resistance of the sheets is lower than or equal to 0.50 DEG C / W, and the heat conduction coefficient is larger than or equal to 2.0 W / mk. The method for manufacturing the high-thermal-conductivity aluminum-based copper clad plate is very suitable for wide promotion and application in the field of light-emitting diode (LED) industries.
Description
technical field [0001] The invention relates to a method for manufacturing a copper-clad laminate material, in particular to a method for manufacturing a high-thermal-conductivity aluminum-based copper-clad laminate. Background technique [0002] In China, the state-owned 704 factory began to develop aluminum substrates in the late 1980s, and soon commercial products came out. At that time, they were mainly used in STK series power amplifier hybrid integrated circuits. In the past two years, high-power LED lighting has followed the trend of energy conservation and environmental protection. , has achieved rapid development, and the demand for aluminum substrates for LEDs is increasing. [0003] At present, most of the aluminum substrates of many domestic enterprises use commercialized FR-4 semi-cured (1080) (thermal conductivity is only 0.3W / mk) as the insulating layer. There is no thermal conductive filler added to the insulating layer, and the thermal conductivity of epoxy ...
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IPC IPC(8): B32B15/08B32B37/06B32B37/10C09J163/02C09J109/02C09J11/04B32B38/18
Inventor 刘阳严小雄席亚军
Owner 陕西泰信电子科技股份有限公司