Semiconductor integrated circuit and receiving apparatus

A technology of integrated circuits and semiconductors, applied in electrical components, impedance matching networks, transmission systems, etc., and can solve the problems of deterioration of noise characteristics of analog circuits, difficulty in low-voltage operation, and increased installation costs.

Inactive Publication Date: 2015-03-18
KK TOSHIBA
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In an SoC (System on Chip: System on Chip) where analog and digital are mixed, signals generated by digital circuits and their harmonics affect analog circuits through power supply wiring, etc., and there is a problem that the noise characteristics of analog circuits deteriorate
For example, in a receiver, the noise characteristics of an LNA (Low Noise Amplifier: Low Noise Amplifier), one of the analog circuits, may deteriorate
In order to reduce the influence of noise, it is considered to set the LNA as a differential input, but due to the increase of input pins, the installation cost increases
In the differential configuration, a large voltage margin is required to generate a tail current source, so it is difficult to operate with a low voltage

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor integrated circuit and receiving apparatus
  • Semiconductor integrated circuit and receiving apparatus
  • Semiconductor integrated circuit and receiving apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment

[0031] figure 1 It is a schematic block diagram of the receiving apparatus 100 of the first embodiment. The receiving device 100 includes an LNA (semiconductor integrated circuit) 2, a LO (Local Oscillator: local oscillator) signal generating unit 3, a demodulation circuit 4, and an output signal processing circuit 5. The receiving device 100 is mounted on, for example, a wireless LAN (Local Area Network) device, and processes the radio wave signal received by the antenna 1 and outputs it to the outside.

[0032] LNA2 amplifies the radio wave signal received by antenna 1. The LO signal generating unit 3 generates an LO signal that serves as a reference for the demodulated radio wave signal. The frequency of the LO signal is 2.5 GHz, for example. The demodulation circuit 4 demodulates the amplified radio wave signal based on the LO signal. More specifically, the demodulation circuit 4 includes a mixer 4a, a VGA (Variable Gain Amplifier) ​​4b, an ADC (Analog to Digital Converter...

no. 2 Embodiment

[0082] The first embodiment described above is provided with an impedance adjusting section having a fixed impedance value. On the other hand, in the second embodiment described below, an impedance adjusting section with variable impedance is provided.

[0083] Picture 11 It is a schematic block diagram of an example of the internal structure of the LNA 21 of the second embodiment. Picture 11 In, and figure 2 The same components are given the same symbols, and the following description focuses on the differences.

[0084] The control signals V1 to V3 are input to the impedance adjustment sections 111c, 121b, and 131b of the LNA 21, respectively. By the control signals V1 to V3, the impedance of the impedance adjusting parts 111c, 121b, and 131b can be variably controlled. versus figure 2 Similarly, at least one of the transconductance circuit 111 and the load circuits 121 and 131 may have an impedance adjustment unit to which a control signal is input.

[0085] Even if the impe...

no. 3 Embodiment

[0099] The third embodiment automatically sets the control signal in the second embodiment.

[0100] Figure 19 It is a schematic block diagram of the receiving apparatus 101 of the third embodiment. Figure 19 In, and figure 1 The same components are given the same symbols, and the following description focuses on the differences.

[0101] Figure 19 The receiving device 101 further includes a detection circuit 6 and a control circuit 7. In addition, LNA21 such as Picture 11 As shown, there is at least one impedance adjusting part that variably controls impedance according to a control signal. The detection circuit 6 detects degradation of the output signal of the output signal processing circuit 5. The control circuit 7 sets the control signal of the LNA 21 to suppress the deterioration of the output signal.

[0102] The control circuit 7 sets all control signals to all values, for example, and finally sets the value that most suppresses the degradation of the output signal amon...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

According to one embodiment, a semiconductor integrated circuit has a transconductance circuit, a first load circuit, and a second load circuit. The transconductance circuit has a first current generator configured to generate a first current depending on an input voltage, and a second current generator configured to generate a second current depending on the input voltage. The first load circuit has a first load configured to output a first output voltage depending on the first current from a first output terminal. The second load circuit has a second load configured to output a second output voltage depending on the second current from a second output terminal. At least one of the transconductance circuit, the first load circuit and the second load circuit comprises an impedance adjusting module configured to adjust impedance.

Description

[0001] Cross references to related applications [0002] This application is based on and claims Japanese Patent Application 2011-64572 filed on March 23, 2011, the entire content of which is incorporated herein by reference. Technical field [0003] The embodiment relates to a semiconductor integrated circuit and a receiving device. Background technique [0004] In a SoC (System on Chip) with mixed analog and digital loading, the signal generated by the digital circuit and its higher harmonics affect the analog circuit through the power supply wiring, etc., and there is a problem that the noise characteristics of the analog circuit deteriorate. For example, in the receiving device, the noise characteristics of the LNA (Low Noise Amplifier), which is one of the analog circuits, may be degraded. In order to reduce the influence of noise, consider setting the LNA as a differential input, but due to the increase in input pins, the installation cost increases. In the differential conf...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): H03H11/28H04B1/16
CPCH04B1/16
Inventor 织田翔子出口淳
Owner KK TOSHIBA
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap