Method for precleaning silicon wafer

A technology for pre-cleaning and silicon wafers, applied in cleaning methods and utensils, cleaning methods using liquids, chemical instruments and methods, etc., can solve problems such as not being environmentally friendly, increasing sewage treatment costs, reducing mortar recycling rate, etc., to achieve improvement The effect of recycling rate and reducing the cost of sewage treatment

Inactive Publication Date: 2012-10-03
苏州协鑫科技发展有限公司
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0004] In the traditional pre-cleaning method, since the mortar adhering to the silicon wafer is washed away, the recycling rate of the mortar is reduced, and the cost of sewage treatment is increased at the same time, and it is not environmentally friendly

Method used

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  • Method for precleaning silicon wafer
  • Method for precleaning silicon wafer

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Embodiment Construction

[0019] The idea of ​​the silicon wafer pre-cleaning method in this embodiment is: when pre-cleaning the cut silicon wafers, the silicon wafers are soaked first, and then sprayed after soaking. Use soaking to remove most of the mortar on the silicon wafer, and use spray to remove a small amount of mortar remaining on the silicon wafer after soaking.

[0020] Most of the mortar on the silicon wafer after cutting is soaked and detached, which is convenient to collect the mortar water produced by soaking, so that the soaked mortar water can be recycled and reused in the mortar recycling enterprise, which improves the mortar recycling rate and reduces Sewage treatment costs, to achieve the purpose of environmental protection.

[0021] Usually, when pre-cleaning the cut silicon wafer, in addition to removing the mortar on the silicon wafer, processing steps such as ultrasonic overflow and degumming are also performed. Ultrasonic overflow is used to preliminarily remove some foreign...

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Abstract

The invention relates to a method for precleaning a silicon wafer. The method is characterized by comprising the following steps of: soaking the cut silicon wafer, and spraying the soaked silicon wafer. According to the method, most of mortar coated on the cut silicon wafer is soaked to be separated from the silicon wafer, and mortar water generated by soaking is collected, so that the soaked mortar water is subjected to secondary recycling in mortar recovery enterprises, the recovery utilization rate of the mortar is improved, the cost of sewage treatment is reduced, and the aim of environment friendliness is fulfilled.

Description

technical field [0001] The invention relates to the field of solar silicon chip processing, in particular to a silicon chip pre-cleaning method. Background technique [0002] After the solar silicon wafer is cut, the silicon wafer needs to be cleaned, and the cleaning steps include pre-cleaning and re-cleaning. The pre-cleaning method is mainly to remove the mortar adhered to the silicon wafer after cutting the solar silicon wafer, and the second cleaning is to remove various pollutants adhered to the surface of the silicon wafer, such as copper and iron, by various methods such as pickling. [0003] Please refer to figure 1 , the traditional pre-cleaning method is to use a pre-cleaning degumming machine to spray water mist with a certain water pressure in the first and second tanks to wash away the mortar adhered to the silicon wafer after cutting, and then use the third and fourth tanks Ultrasonic overflow washes away the residual mortar, and the mortar water produced by...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/04B08B3/02B08B3/04B08B13/00
Inventor 陈志军
Owner 苏州协鑫科技发展有限公司
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