Low-capacity glass solid packaged silicon transient voltage suppressor and manufacturing method thereof
A technology of transient voltage suppression and manufacturing method, applied in the direction of semiconductor/solid-state device manufacturing, circuits, electrical components, etc., can solve the problems of high-frequency signal distortion, signal distortion, etc., to solve the problem of large junction capacitance, low junction capacitance, volume small effect
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[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0028] Such as figure 1 As shown, the present invention provides a low-capacitance glass-encapsulated silicon transient voltage suppression diode, which includes a housing 10 and lead wires 20 drawn from both ends of the housing 10, and also includes a transient voltage suppressor disposed in the housing 10. Suppression diode die 30, rectifier diode die 40, several aluminum sheet layers 50 and two molybdenum electrodes 60, the transient voltage suppression diode di...
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