Low dielectric constant glass fiber with low wire drawing temperature

Abstract

The invention discloses a low dielectric constant glass fiber with a low wire drawing temperature, which is prepared by the following raw materials in percentage by weight: 48-55wt% of SiO2, 12-16wt% of Al2O3, 22-27wt% of B2O3, 3-7wt% of CaO, 0.5-6wt% of La2O3, 0-2wt% of CaF2, 0-1wt% of Na2O, K2O and Li2O, 0-0.45wt% of MgO, 0-0.45wt% of SO3, 0-0.45wt% of TiO2, and 0-0.45wt% of Fe2O3, wherein the Na2O, the K2O and the Li2O are mixed in an arbitrary proportion; after being transported to a mixing bin and mixed uniformly and fully, the raw materials are sent to a tank furnace for melting, clarification and homogenizing for 8 hours at 1600 DEG C and then flow out through a 4000-hole platinum bushing, and the low dielectric constant glass fiber is obtained under the driving of a wire drawing machine. The water resistance of the glass fiber provided by the invention is better than those of an E glass fiber and a D glass fiber; the adhesion of the glass fiber disclosed by the invention with resin is good; and the glass fiber disclosed by the invention is easy for subsequent processing and especially suitable for serving as a reinforced material of a printed circuit board.

Description

technical field [0001] The invention relates to a low dielectric constant and low dielectric loss glass fiber with low drawing temperature, which can be used as a reinforcing material for printed circuit boards. Background technique [0002] In the past ten years, due to the rapid development of the electronic information industry, printed circuit boards have developed in the direction of high density, multi-layer, and super-multi-layer. It acts as a built-in passive component function in a multilayer board, etc. This requires materials with low dielectric constant and dielectric loss. This is because the smaller the dielectric constant of the material, the faster the signal propagation speed; at a certain propagation frequency, the smaller the dielectric loss of the material, the smaller the propagation loss. Printed circuit boards are usually composed of resin and fiberglass. The dielectric properties of resins conventionally used for printed circuit boards are satisfac...

AI Technical Summary

Problems solved by technology

Although the above-mentioned developed glass fiber composition can meet the requirements of use in terms of dielectric properties, the glass has poor melting properties and high drawing temperature (all above 1280°C, most of them are around 1350°C), which makes the drawing operation difficult, and at the same time, the kiln Strict furnace temperature requirements will reduce the life of the tank kiln, so the production cost is high and it is difficult to produce on a large scale

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