Solar photoelectric conversion transparent thin film
A transparent film, photoelectric conversion technology, applied in the field of solar power generation, can solve the problem of waste of solar radiation energy, and achieve the effect of improving photoelectric conversion efficiency and reducing thermal effect.
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Embodiment 1
[0014] Zinc oxide doped with 0.15wt% La and indium oxide with a purity of 99.99% were used as targets, and a medium frequency reaction vertical magnetron sputtering coating equipment was used for coating.
[0015] With the silicon wafer as the substrate, the silicon wafer is first cleaned, dried and put into the coating chamber, and O with a purity of 99.99% is introduced 2 , the flow rate is 150 sccm, the voltage is 800 V, the current is 25 A, the substrate temperature is 300 ° C, and the working pressure is 0.5 Pa. By controlling the sputtering speed of each target, a transparent film with the required composition and ratio is deposited.
Embodiment 2
[0017] Zinc oxide doped with 0.25wt% La and indium oxide with a purity of 99.99% were used as targets, and a medium frequency reaction vertical magnetron sputtering coating equipment was used for coating.
[0018] Taking the silicon wafer as the substrate, the silicon wafer is firstly cleaned, dried and put into the coating chamber, and O2 with a purity of 99.99% is introduced, the flow rate is 150 sccm, the voltage is 800 V, the current is 25 A, and the substrate temperature is The temperature is 400°C, and the working pressure is 0.5Pa. By controlling the sputtering speed of each target, a transparent film with the required composition and ratio is deposited.
Embodiment 3
[0020] Zinc oxide doped with 0.20wt% La and indium oxide with a purity of 99.99% were used as targets, and a medium frequency reaction vertical magnetron sputtering coating equipment was used for coating.
[0021] Taking the silicon wafer as the substrate, the silicon wafer is firstly cleaned, dried and put into the coating chamber, and O2 with a purity of 99.99% is introduced, the flow rate is 150 sccm, the voltage is 800 V, the current is 25 A, and the substrate temperature is The temperature is 500°C, and the working pressure is 0.5Pa. By controlling the sputtering speed of each target, a transparent film with the required composition and ratio is deposited.
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