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Dustproof pellicle component frame, manufacturing method thereof and dustproof pellicle component

A technology for dust-proof film components and frames, which is applied in the photoengraving process of the pattern surface, the original for photomechanical processing, optics, etc., to achieve the reduction of shedding and dust generation, and it is not easy to crack and spread, deform and flex. small effect

Active Publication Date: 2015-01-21
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Thus, the degree of freedom of the dimensional design of the pellicle assembly frame is almost gone, so it is difficult to improve the rigidity of the pellicle assembly frame by increasing the cross-sectional area of ​​the pellicle assembly frame

Method used

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  • Dustproof pellicle component frame, manufacturing method thereof and dustproof pellicle component
  • Dustproof pellicle component frame, manufacturing method thereof and dustproof pellicle component
  • Dustproof pellicle component frame, manufacturing method thereof and dustproof pellicle component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0051] Hereinafter, examples of the present invention will be described in detail, but the scope of the present invention is not limited to these examples.

[0052] (Example 1)

[0053] Such as Figure 4As shown, an impregnated elongated sheet-shaped body 30 (prepreg) obtained by impregnating a plurality of long-fibrous carbon fibers 24a distributed in the longitudinal direction with epoxy resin (trade name; Daiyali -ド) HYEJ25M80D, manufactured by Mitsubishi Plastics Corporation). As the main part of the pellicle frame 10, the sheet-shaped bodies 30a, 30d forming the long sides have dimensions of 1780×50 mm and 1680×50 mm. In addition, as the main part of the pellicle frame 10, the sheet-shaped bodies 30b and 30c forming the short sides have dimensions of 1460×50mm and 1560×50mm. The sheets 30a, 30b, 30c, 30d are stacked on Figure 7 The groove portion 38 of the lamination jig 36 made of aluminum alloy is shown. At this time, the formation of gaps should be avoided as muc...

Embodiment 2

[0059] Using the laminated body 34 formed in the same manner as in Example 1 with an outer dimension of 920×770mm, an inner dimension of 870×720mm, and a thickness of 6.2mm, the outer dimension is 904.5×750mm, the inner dimension is 894.5×738mm, the height is 5.8mm, and the outer dimension of the corner is R6mm. , an inner dimension R2mm, and a dust-proof film assembly frame 10 with four ventilation holes 16 with a diameter of 1.5mm arranged on each long side. The pellicle frame 10 was washed and dried in the same manner as in Example 1, and an acrylic resin (trade name; ST Sater's (Erecoat ST Satyina, manufactured by Shimizu Co., Ltd.) Apply by electrocoating to form a resin film 27. Further, the pellicle frame 10 is washed with a surfactant and pure water, and after drying, the same as in Example 1, on the pellicle frame 10. The sticking surface 12 and the step surface 28 form a pellicle adhesive layer and a photomask adhesive layer 46 respectively, and a peeling sheet 48 is...

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Abstract

PURPOSE: A pellicle frame, a manufacturing method of the same, and a pellicle are provided to prevent an exposure area from being reduced by bearing warpage to the pellicle frame. CONSTITUTION: A pellicle frame(10) is polygonal, and each side of the pellicle frame is made of fine and long materials(14, 20). The fine and long materials are made of the complex material of long fiber type carbon fiber and a resin. The carbon fiber is arranged to the longitudinal directions of the fine and long materials. The entire surfaces of the fine and long materials are covered with the resin in order not to expose the carbon fiber. A plurality of fine and long material-based sheets is prepared and stacked to form the fine and long materials.

Description

technical field [0001] The present invention relates to a pellicle frame used as a dustproof article in the manufacture of semiconductor devices, printed circuit boards, liquid crystal displays, etc., its manufacturing method, and a pellicle. Background technique [0002] In the manufacture of semiconductors such as LSI and super LSI or the manufacture of liquid crystal displays, semiconductor wafers or original plates for liquid crystals are patterned by irradiation with light. If there is dust on the photomask or reticle (hereinafter referred to as photomask) used at this time, the dust will absorb light or bend light, so that the transferred pattern will be deformed, and the edge of the pattern will become blurred. Vague. Furthermore, contamination of the base to which the pattern is transferred may impair the size, quality, appearance, etc. of the transferred pattern. For this reason, these operations are usually performed in a clean room, and even then it is difficult...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F1/48
CPCG03F1/22G03F1/38G03F1/62G03F1/64G03F7/70916
Inventor 関原一敏
Owner SHIN ETSU CHEM IND CO LTD
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