Magnetic pole component, magnetron provided with magnetic pole component, sputtering chamber apparatus, and substrate processing device

Abstract

Disclosed are a magnetic pole component, a magnetron provided with the magnetic pole component, a sputtering chamber apparatus, and a substrate processing device. The magnetic pole component comprises a plurality of magnets which are arranged at intervals and a plurality of magnetic pole elements which are arranged on the first ends of the plurality of the magnets respectively to connect the plurality of the magnets together in sequence, wherein each magnetic pole element is rotatable relative to the magnet to which the magnetic pole element is connected and adjacent magnetic pole elements are rotatable relative to each other. According to the invention, the shape of the magnetic pole component can be changed conveniently because each magnetic pole element is rotatable relative to the magnet to which the magnetic pole element is connected and adjacent magnetic elements are rotatable relative to each other. Therefore, when the magnetic pole component is respectively used as an internal magnetic pole component and an external magnetic pole component and arranged on a magnetic yoke to assemble a magnetron, the shape of the magnetron can be conveniently changed by cooperating the magnetic pole component with the magnetic yoke, so that surface etching effect of targets is optimized without redesigning the magnetron.

Description

technical field [0001] The invention relates to semiconductor integrated circuit manufacturing equipment, in particular to a magnetic pole assembly and its magnetron, sputtering chamber device and substrate processing device. Background technique [0002] In the manufacture of semiconductor integrated circuits, magnetron sputtering technology is used to deposit many different metal layers and related material layers. The feature of magnetron sputtering technology is that a magnetron is set on the back of the target to provide a magnetic field passing through the target, so as to form a magnetic field distribution on the side of the target facing the vacuum chamber. The magnetic field distributed between the inner magnetic pole and the outer magnetic pole on the surface of the target can force the electrons in the plasma to move in a certain orbit, and the orbit of the electrons controlled by the magnetron will not only affect the erosion rate of the target at different posit...

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Problems solved by technology

Although the inner and outer magnetic pole spacing, the inner magnetic pole assembly spacing of the same magnetic pole, the number of tracks, etc. can be changed through multiple calculation optimizations to improve the uniformity of deposition, the magnetron of the prior art has the following problems in application: due to the magnetron The shape of the tube, the distance between the inner and outer magnetic poles, and the distance between the magnet components in the same pole are all fixed, so that the magnetic field intensity distribution of the magnetron on the target surface is fixed, so different targets (including different shapes, sizes, etc.) are engraved During corrosion, if the expected or ideal target corrosion uniformity and target utilization are not achieved, the magnetron needs to be redesigned or changed

Can't adjust easily

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