Prepreg with moderate-temperature cured epoxy resin as substrate material and preparation method thereof

A technology for curing epoxy resin and matrix material, applied in the field of prepreg and its preparation, can solve the problems of unfavorable product dimensional accuracy, high product energy consumption, short storage time, etc., to improve product dimensional stability, excellent mechanical properties, The effect of reducing manufacturing costs

Inactive Publication Date: 2012-10-24
HARBIN FRP INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims to solve the problems of high curing temperature of the existing epoxy resin prepreg, high energy consumption for preparing the product, unfavorable control of the d

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0009] Embodiment 1: A prepreg with medium-temperature curing epoxy resin as the matrix material is made of medium-temperature curing epoxy resin impregnated with reinforcing materials; wherein the medium-temperature curing epoxy resin is composed of 50% to 90% epoxy resin mixture by mass fraction , 5%~30% curing agent system mixture and 5%~20% toughening agent; the epoxy resin mixture is composed of 20%~80% solid or semi-solid epoxy resin and 20%~80% It is made by mixing liquid epoxy resin; the curing agent system mixture is made by mixing 40%~90% curing agent and 10%~60% accelerator according to the mass fraction.

[0010] The curing temperature of a prepreg with a medium-temperature curing epoxy resin as the matrix material designed in this embodiment is 70°C to 100°C, and a lower curing temperature can reduce the manufacturing cost of the composite material product and improve the dimensional stability of the product; Prepregs are suitable for autoclave forming, vacuum for...

specific Embodiment approach 2

[0011] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the described solid or semi-solid epoxy resin is bisphenol A type epoxy resin, bisphenol S type epoxy resin and novolac epoxy resin One or a combination of several; liquid epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, trifunctional epoxy resin, tetrafunctional epoxy resin, One or a combination of novolac epoxy resins and formaldehyde novolac epoxy resins. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0012] Specific embodiment three: the difference between this embodiment and specific embodiment one or two is: the curing agent is a dicyandiamide compound or a modified product of a dicyandiamide compound; the accelerator is a urea compound, One or more combinations of polyurea compounds, polyetheramine compounds, imidazole and imidazole derivatives; the toughening agent is a core-shell particle toughening agent, epoxy resin and rubber prepolymer, One or more combinations of epoxy-terminated rubber and hydroxyl-terminated rubber. Others are the same as in the first or second embodiment.

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Abstract

The invention relates to a prepreg with moderate-temperature cured epoxy resin as a substrate material and a preparation method of the prepreg, relates to a prepreg and a preparation method of the prepreg, and is used for solving the problems that the prepreg is prepared at the curing temperature higher than 120 DEG C, so that the product is high in energy consumption and the dimensional accuracy of the product is difficult to control. The prepreg with moderate-temperature cured epoxy resin as the substrate material is composed of an epoxy resin mixture, a curing agent system mixture and a moderate-temperature cured epoxy resin infiltration reinforcing material prepared by a toughening agent, wherein the epoxy resin mixture is composed of solid or semisolid epoxy resin and liquid epoxy resin, and the curing agent system mixture is composed of a curing agent and a promoter. The preparation method comprises the steps of: (1) preparing the epoxy resin mixture; (2) preparing the curing agent system mixture; (3) preparing the moderate-temperature cured epoxy resin; and (4) preparing the prepreg. The prepared product can be used for preparing planes, spacecrafts, yachts, golf rods and the like, and has important commercial value.

Description

technical field [0001] The invention relates to a prepreg and a preparation method thereof. Background technique [0002] Advanced resin-based composite materials play a pivotal role in aerospace, electronics, transportation, energy and other fields, and have gradually become one of the most competitive new material fields in the world. Epoxy resin prepreg has the characteristics of high specific strength, high specific modulus, designable performance and diverse forming processes, and is widely used in aerospace and civil fields. [0003] When the curing temperature of the epoxy resin prepreg is higher than 120°C, the resulting product will have a large internal stress, which is not conducive to controlling the dimensional accuracy, and may even lead to premature failure of the material. The higher curing temperature has higher requirements on the molding equipment, mold tooling and auxiliary materials of composite materials and high energy consumption, and the storage tim...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L63/04C08L63/00C08G59/50C08J5/24C08J5/18
Inventor 林再文李树茂董鹏高赫王明寅侯涤洋
Owner HARBIN FRP INST
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