Packaging structure for active matrix organic electroluminescent diode panel
A packaging structure and matrix technology, applied in circuits, electrical components, electric solid devices, etc., can solve the problems of poor adhesion and inability to achieve, achieve excellent sealing and adhesion of packaging, and solve poor adhesion. Effect
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[0030] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0031] see figure 1 , the present invention provides a packaging structure of an active matrix organic electroluminescent diode panel, comprising: a substrate 20, a pixel region 26 located on the substrate 20, several turns of inorganic Packaging material 24, several turns of organic bonding material 22 located outside the pixel area 26 on the substrate 20, and a back cover (not shown) covering the inorganic packaging material 24 and the organic bonding material 22, the several turns of inorganic packaging material 24 At least one circle of the organic adhesive material 22 airtightly surrounds the pixel area 26 , at least one circle of the organic adhesive material 22 airtightly surrounds the pixel area 26 , and the inorganic packaging materia...
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