Tantalum nitride sheet-type thin film resistor and manufacturing method thereof

Abstract

The present invention discloses a tantalum nitride sheet-type thin film resistor, including an insulating substrate, two surface electrodes and two back electrodes respectively disposed on the front and rear surfaces of the insulating substrate, terminal electrodes disposed on both ends of the insulating substrate and connected with the surface electrodes and the back electrodes, an intermediate electrode covering the surfaces of the surface electrodes, the back electrodes and the terminal electrodes, an external electrode covering the surface of the intermediate electrode, a resistive layer arranged between the two surface electrodes and connected with the two surface electrodes, and an insulating encapsulating layer covering the surface of the resistive layer, wherein the resistive layer is a tantalum nitride thin film. The tantalum nitride sheet-type thin film resistor of the present invention has the characteristics of high precision, small temperature coefficient of resistance, moisture resistance, high stability and good high-frequency performance. Compared with other thin film products, the tantalum nitride thin film has the advantages of higher stability and lower temperature coefficient of resistance, and can be applied under more harsh natural conditions, therefore the tantalum nitride thin film resistors of high power can bring higher economic benefit.

Description

technical field [0001] The invention relates to the field of resistor manufacturing, in particular to a tantalum nitride chip thin film resistor and a manufacturing method thereof. Background technique [0002] Chip resistors are the basic components of chip resistor network products, and are called the "cells" of electronic equipment. The accuracy and reliability of electronic equipment depend to a large extent on the quality of chip resistors. With the rapid development of microelectronics technology, the requirements for the power of chip resistors are getting higher and higher, and it is inevitable that chip resistors will develop in the direction of high power. With the advancement of science and technology, the development of electronic products tends to be sophisticated, miniaturized and integrated, so the demand for high-power thin film resistors is becoming more and more urgent. Tantalum nitride thin film is used in the manufacture of thin film hybrid integrated ci...

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Problems solved by technology

[0003] Tantalum nitride film is used in the manufacture of thin film hybrid integrated circuits due to its excellent performance. Tantalum nitride film is a stable resistive film with good electrical properties, such as TaN and Ta2N have a low temperature coefficient. At the same time, TaN thin film is also a good diffusion barrier film, so it is widely used as a diffusion barrier material in semiconductor integrated circuits and in composite metal oxide semiconductors. TaN thin film resistors are used in thin film technology and embedded passive components of multi-chip components. It has a very wide range of application values, but the application of tantalum nitride thin film in high-power thin film chip resistors has not been reported.

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