Die Bonder Feeding System

Abstract

The invention discloses a feeding system of a die bonder. The feeding system of the die bonder comprises a magazine device and a loading and unloading work table. The magazine device comprises left and right transfer modules for transferring a magazine and upper and lower transfer modules for successively pushing a base plate on the magazine into the loading and unloading work table. The loading and unloading work table comprises a bottom plate and a panel which are arranged at an interval. A conveyer belt device for carrying and conveying the base plate is arranged between the bottom plate and the panel. The conveyer belt device comprises two rows of belt wheel conveying mechanisms arranged in parallel. A lifting plate parallel to the bottom plate is arranged between the two rows of belt wheel conveying mechanisms. The lifting plate is driven by a linear driving mechanism to be lifted between the bottom plate and the panel. According to the feeding system of the die bonder, the base plate in the magazine is pushed into the loading and unloading work table automatically, and the base plate in the loading and unloading work table is fixed with the panel through the lifting plate for the convenience of die bonding. The work efficiency is high, and the base plate is automatically fed through the structure disclosed by the invention, so that the efficiency of accessing the base plate is effectively improved, and the production efficiency is improved.

Description

technical field

[0001] The invention relates to the field of semiconductor packaging equipment, in particular to a feeding system for a crystal bonder. Background technique

[0002] The crystal bonding machine is the key equipment in the LED assembly line. Its crystal bonding process is as follows: the dispensing mechanism first dispenses glue on the crystal bonding station of the substrate, and then the swing arm (also called the crystal arm) moves the LED die from the crystal Take it out of the circle and transfer it to the die-bonding station where the glue has been dispensed. When all the die-bonding points on the entire substrate have solidified the die, the substrate is taken out from the workbench, and an empty substrate is placed again, and then the die-bonding starts. Before the die bonding, the substrates are stacked in the material box. When the die bonding is required, they are manually taken out of the material box one by one and placed on the worktable and fix...

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