Flexible even temperature plate

Abstract

A flexible even temperature plate belongs to the technical field of heat conducting and comprises a liquid filling pipe (1), a capillary wicking (2), a casing (3) and a heat conducting area (6), wherein the capillary wicking (2) comprises a sintered copper mesh (4) and a fine mesh (5). The even temperature plate has high heat conducting rate and can achieve a curve effect so as to have strong surface adaptability.

Description

Technical field [0001] The invention relates to a flexible uniform temperature plate, which belongs to the technical field of heat transfer. Background technique [0002] With the rapid development of science and technology, the unit heat output of electronic components is increasing. In order to take away the heat generated by the heat source in time, the heat dissipation area of ​​the heat sink is usually much larger than the area of ​​the heat source, which leads to the heat sink. Due to the inhomogeneity of the heat flow distribution in the heat transfer area, the traditional thermal diffusion plate can only distribute the heat flow evenly to a certain extent due to the limitation of its own thermal conductivity, while the uniform temperature plate can make the temperature distribution more uniform. The advantages in heat treatment of electronic components are becoming more and more obvious. In addition, the existing heat exchange equipment cannot be applied to some cur...

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Problems solved by technology

[0003] In order to solve the problems of low thermal conductivity of existing heat exchange equipment and the inapplicability of irregular heat dissipation surfaces, the invention provides a flexible vapor chamber, which not only has high thermal conductivity, but also can be bent to achieve curved surfaces State heat conduction, so it can be used on some special components such as radar

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