Silicon wafer processing device and processing method thereof
The technology of a processing device and a processing method, which is applied to the exposure devices, optics, instruments, etc. of the photo-engraving process, can solve the problems of high cost, high energy consumption, and many control objects, so as to improve the energy utilization rate, reduce the cost, and improve the The effect of reliability and compactness
Active Publication Date: 2016-01-20
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology
[0006] In the prior art, silicon wafer pre-alignment and silicon wafer edge exposure consist of two sets of light sources and two sets of optical lenses, and there are many objects to be controlled, the system design is complicated, the energy consumption is high, and the cost is also high
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[0024] In order to better understand the technical content of the present invention, specific embodiments are given and described as follows in conjunction with the accompanying drawings.
[0025] Please see figure 1 , figure 1 Shown is a schematic structural view of the silicon wafer processing device of the present invention.
[0026] The silicon wafer processing device is used for processing the silicon wafer 9 fixed on the silicon wafer rotary table 8 .
[0027] The silicon wafer processing device includes the following components along the optical path: a light source 6 , a light source shutter 5 , an optical lens 4 , a photodetector shutter 2 , and a photodetector 1 .
[0028] The silicon wafer processing device also includes a control unit 7, which is electrically connected to the light source 6, the light source shutter 5, the optical lens 4, the photodetector shutter 2, the photodetector 1, and the silicon wafer rotating table 8 to control the above components.
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The invention discloses a silicon wafer processing device and the processing method thereof, which are used for performing pre-alignment and edge exposure on a silicon wafer. The silicon wafer processing device comprises a light source and an optical lens along a light path, wherein the optical lens comprises a filter plate unit; the filter plate unit comprises one filter plate for pre-alignment and another filter plate for exposure; the filter plate for pre-alignment passes through light of pre-alignment waveband; the filter plate for exposure passes through light of exposure waveband; and one of the filter plate for pre-alignment and the filter plate for exposure is set to be in a working state. According to the device, the same light source, the same optical lens, a sensor and a silicon wafer rotation table are used in edge exposure and pre-alignment of the silicon wafer, so that the energy utilization rate is increased, the cost of a complete set of system is reduced, and the reliability and compactness of the complete set of system are also improved at the same time.
Description
technical field [0001] The invention relates to a silicon wafer processing device, and in particular to a silicon wafer processing device integrating multiple functions, and a silicon wafer processing method thereof is also proposed. Background technique [0002] Electroplating is one of the most important processes for post-packaging of IC circuits. It uses the edge of the silicon chip as the anode, and the electroplating window in the middle of the silicon chip as the cathode, and then adds a certain DC working voltage between the cathode and anode. The concentration of the plating solution in the tank is used to control the height of the metal bump. [0003] Since the photoresist is not conductive, the photoresist at the edge of the silicon wafer needs to be removed before the electroplating process, and the width of the edge removal depends on the width of the edge removal of the previous silicon wafer edge exposure (Wafer Edge Exclusion, WEE) process. [0004] There ar...
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IPC IPC(8): H01L21/00H01L21/02G03F7/20G03F9/00
Inventor 李中秋徐兵李志丹
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD