Device and method for placing predetermined element on target platform

A component and target technology, applied in the structural field of detecting and improving component placement accuracy, can solve problems such as monitoring chips, and achieve the effects of improving placement accuracy, reducing rework, and improving yield

Inactive Publication Date: 2013-01-02
温泰克工业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is no easy way for the user or manufacturer to monitor whether the chip is proper

Method used

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  • Device and method for placing predetermined element on target platform
  • Device and method for placing predetermined element on target platform
  • Device and method for placing predetermined element on target platform

Examples

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Embodiment Construction

[0043] According to the present invention, alignment and probing techniques are described that improve the accuracy of component placement in assembly. More specifically, the present invention includes structures and methods for detecting and improving component placement accuracy on a target platform by incorporating alignment marks onto the component and reference marks onto the target platform using various probing techniques. A set of sensors in an array to form a multi-sensor probe capable of detecting deflection of a displacement element during assembly. Merely by way of example, the invention is applied to placing packaged devices on electronic substrates for electronic system fabrication. It should be realized, however, that the invention has broader applicability. Further details of the invention can be found throughout the specification of the invention, and in more detail below.

[0044] alignment mark

[0045] According to a preferred embodiment, the alignment...

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Abstract

The invention discloses a device and a method for placing a predetermined element on a target platform, and relates to an assembly technique. According to the device and the method, alignment and detection techniques for improving element placing accuracy in the assembly are described. Particularly, the device and the method include that the placing accuracy of the element on the target platform is detected and improved by combining alignment signs on the element and reference signs on the target platform in various detection techniques. A group of sensors which form an array to form multi-sensor probes can detect the offset of offset elements in the assembly.

Description

[0001] The present invention is based on the application number 200610109038.8, the application date is July 31, 2006, and the applicant "Wintech Industry Co., Ltd.", entitled "A device and method for placing predetermined components on a target platform". technical field [0002] The present invention relates generally to assembly techniques, and more particularly to detecting and improving component placement accuracy on target platforms by incorporating alignment marks onto the components and reference marks onto the target platform using various probing techniques Degree structure and methods. Background technique [0003] Electronic devices have evolved over the years. As integrated circuits (ICs) increase in complexity and speed of operation, it is not uncommon for the number of devices to have pin counts in excess of a few hundred or even a thousand to increase. For example, high-speed designs require more power and ground pins. Such differential pairs are replacing...

Claims

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Application Information

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IPC IPC(8): H01L21/68H01L21/66H05K13/04H05K13/08
Inventor 孔-琛·陈
Owner 温泰克工业有限公司
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