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Subscriber identity module (SIM) card injection compression molding process

A technology of injection molding compression and molding technology, applied in the direction of coating, etc., can solve the problems of high size requirements, high production difficulty, PVC easy to decompose environment and personnel injury, and achieve the effect of reducing environmental pollution and human injury

Inactive Publication Date: 2013-01-09
NANJING HUAGE ELECTRONICS & AUTOMOBILE PLASTIC IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, domestic SIM card production mainly uses PVC material stamping and molding process, while foreign countries use ABS material for injection molding. The cost of PVC material stamping and molding is relatively low, but PVC is easy to decompose and will cause harm to the environment and personnel. From the perspective of environmental protection and human development trends In the future, ABS material injection molding will be the main
At present, there are few domestic technologies for processing SIM cards by ABS injection molding, and the processing of SIM cards by ABS injection molding is still in the initial stage of research and development in China; because the wall thickness of SIM cards is relatively thin and the size requirements are high, the existing injection molding process is used. Production is difficult, therefore, it is necessary to develop a new SIM card molding process, which can use ABS material to produce qualified SIM cards

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] This embodiment is a kind of SIM card injection compression molding process, using injection molding equipment to injection mold through the SIM card mold, the SIM card injection molding material is ABS, and the hot runner of the SIM card mold is heated to ensure that the plastic of the runner and the gate remains in a molten state , The processing standard for the width of the male die core on the gate side of the SIM card mold is 54.28mm, and the processing standard for the male die core size on the side corresponding to the gate is 54.33mm. The barrel temperature of the injection molding equipment is between 230°C, SIM card mold temperature 15°C, injection molding material drying temperature 75°C;

[0016] Injection pressure 1800kg / cm 2 , back pressure 30kg / cm 2 , the pressure keeping adopts three-stage pressure-holding, the first-stage pressure-holding pressure is 800kg / cm 2 , the holding time is 0.07 seconds, which is convenient to control the shrinkage of the w...

Embodiment 2

[0019] This embodiment is a kind of SIM card injection compression molding process, using injection molding equipment to injection mold through the SIM card mold, the SIM card injection molding material is ABS, and the hot runner of the SIM card mold is heated to ensure that the plastic of the runner and the gate remains in a molten state , The processing standard for the width of the male core on the side of the gate of the SIM card mold core is 54.28mm, and the processing standard for the size of the male core on the side corresponding to the gate is 54.33mm. The injection molding equipment has a barrel temperature of 240°C. The mold temperature is 25°C, and the drying temperature of the injection molding material is 80°C;

[0020] Injection pressure 1900kg / cm 2 , back pressure 45kg / cm 2 , the pressure keeping adopts three-stage pressure-holding, the first-stage pressure-holding pressure is 950kg / cm 2 , the holding time is 0.07 seconds, which is convenient to control the ...

Embodiment 3

[0023] This embodiment is a kind of SIM card injection compression molding process, using injection molding equipment to injection mold through the SIM card mold, the SIM card injection molding material is ABS, and the hot runner of the SIM card mold is heated to ensure that the plastic of the runner and the gate remains in a molten state , The processing standard for the width of the male core on the side of the gate of the SIM card mold core is 54.28mm, and the processing standard for the size of the male core on the side corresponding to the gate is 54.33mm. The injection molding equipment has a barrel temperature of 260°C. The mold temperature is 35°C, and the drying temperature of the injection molding material is 85°C;

[0024] Injection pressure 2000kg / cm 2 , back pressure 60kg / cm 2 , the pressure keeping adopts three-stage pressure-holding, the first-stage pressure-holding pressure is 1100kg / cm 2 , the holding time is 0.07 seconds, which is convenient to control the...

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PUM

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Abstract

The invention relates to a molding process of subscriber identity module (SIM) cards, in particular to an SIM card injection compression molding process. An SIM card mold is in a hot runner mode, and a mold core is needed to be designed in a counter-deformation structure. The temperature of a material barrel arranged on an injection molding device is controlled to be 230-260 DEG C, the temperature of the SIM card mold is controlled to be 15-35 DEG C, and the drying temperature of injection molding materials is controlled to be 75-85 DEG C. The injection molding pressure is controlled to be lower than 2000 kg / cm<2>, the backpressure is controlled to be 30-60 kg / cm<2>, and three-stage pressure maintaining is adopted. The injection speed is controlled to be 90-200 mm / s, the injection position is divided into three sections, the cooling time is within 2.5s, and the molding cycle is controlled to be within 8s. By adopting the SIM card injection compression molding process, acrylonitrile butadiene styrene (ABS) materials can be stably used for massively producing the SIM cards, and harm to human bodies and pollution to the environment can be reduced.

Description

technical field [0001] The invention relates to a molding process of a SIM card, in particular to a SIM card injection compression molding process. Background technique [0002] At present, domestic SIM card production mainly uses PVC material stamping and molding process, while foreign countries use ABS material for injection molding. The cost of PVC material stamping and molding is relatively low, but PVC is easy to decompose and will cause harm to the environment and personnel. From the perspective of environmental protection and human development trends From now on, it will be mainly injection molding of ABS material in the future. At present, there are few domestic technologies for processing SIM cards by ABS injection molding, and the processing of SIM cards by ABS injection molding is still in the initial stage of research and development in China; because the wall thickness of SIM cards is relatively thin and the size requirements are high, the existing injection mol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/00B29C45/78B29C45/77B29K55/02
Inventor 李根陶炜朱俊生王康斌朱茂兴张亚文
Owner NANJING HUAGE ELECTRONICS & AUTOMOBILE PLASTIC IND