Subscriber identity module (SIM) card injection compression molding process
A technology of injection molding compression and molding technology, applied in the direction of coating, etc., can solve the problems of high size requirements, high production difficulty, PVC easy to decompose environment and personnel injury, and achieve the effect of reducing environmental pollution and human injury
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Embodiment 1
[0015] This embodiment is a kind of SIM card injection compression molding process, using injection molding equipment to injection mold through the SIM card mold, the SIM card injection molding material is ABS, and the hot runner of the SIM card mold is heated to ensure that the plastic of the runner and the gate remains in a molten state , The processing standard for the width of the male die core on the gate side of the SIM card mold is 54.28mm, and the processing standard for the male die core size on the side corresponding to the gate is 54.33mm. The barrel temperature of the injection molding equipment is between 230°C, SIM card mold temperature 15°C, injection molding material drying temperature 75°C;
[0016] Injection pressure 1800kg / cm 2 , back pressure 30kg / cm 2 , the pressure keeping adopts three-stage pressure-holding, the first-stage pressure-holding pressure is 800kg / cm 2 , the holding time is 0.07 seconds, which is convenient to control the shrinkage of the w...
Embodiment 2
[0019] This embodiment is a kind of SIM card injection compression molding process, using injection molding equipment to injection mold through the SIM card mold, the SIM card injection molding material is ABS, and the hot runner of the SIM card mold is heated to ensure that the plastic of the runner and the gate remains in a molten state , The processing standard for the width of the male core on the side of the gate of the SIM card mold core is 54.28mm, and the processing standard for the size of the male core on the side corresponding to the gate is 54.33mm. The injection molding equipment has a barrel temperature of 240°C. The mold temperature is 25°C, and the drying temperature of the injection molding material is 80°C;
[0020] Injection pressure 1900kg / cm 2 , back pressure 45kg / cm 2 , the pressure keeping adopts three-stage pressure-holding, the first-stage pressure-holding pressure is 950kg / cm 2 , the holding time is 0.07 seconds, which is convenient to control the ...
Embodiment 3
[0023] This embodiment is a kind of SIM card injection compression molding process, using injection molding equipment to injection mold through the SIM card mold, the SIM card injection molding material is ABS, and the hot runner of the SIM card mold is heated to ensure that the plastic of the runner and the gate remains in a molten state , The processing standard for the width of the male core on the side of the gate of the SIM card mold core is 54.28mm, and the processing standard for the size of the male core on the side corresponding to the gate is 54.33mm. The injection molding equipment has a barrel temperature of 260°C. The mold temperature is 35°C, and the drying temperature of the injection molding material is 85°C;
[0024] Injection pressure 2000kg / cm 2 , back pressure 60kg / cm 2 , the pressure keeping adopts three-stage pressure-holding, the first-stage pressure-holding pressure is 1100kg / cm 2 , the holding time is 0.07 seconds, which is convenient to control the...
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