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High-power packaging epoxy resin composition with good forming performances

A technology of epoxy resin and molding performance, which is applied in other chemical processes, chemical instruments and methods, etc., can solve the problems of insufficient melt viscosity of epoxy resin composition, lack of toughening effect, poor bonding force, etc. Effects of good formability and workability, good workability, low melt viscosity

Inactive Publication Date: 2013-01-09
JIANGSU ZHONGPENG NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional silane coupling agent used in this method has a small molecular weight, poor binding force with the inorganic filler, and cannot achieve a certain toughening effect, so that the melt viscosity of the epoxy resin composition is not small enough, so Need to further improve the technology

Method used

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Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0052]Experimental example 1. 90 grams of epoxy resin (a+b) described in embodiment 1; 47 grams of phenolic resin (c+d); 100 grams of silicon carbide; inorganic filler: 560 grams of e part, 80 grams of f part; 1.5 grams of accelerator; 6 grams of flame retardant; 4.5 grams of coupling agent KH-560; 3 grams of colorant carbon black; 3 grams of release agent carnauba wax; 3 grams of silicone. After the components of the raw materials in the above formula are accurately weighed, the silicon micropowder is treated with a coupling agent in the mixer for 5 minutes, then other components are added, and melted and kneaded on a two-roll kneader at a temperature of 90 o C. The mixing time is 10 minutes. Press the mixed material into a 1.5mm thick sheet. After mixing evenly, cool and pulverize it, press it into a cake, and conduct a performance test.

experiment example 2

[0053] Experimental example 2. 90 grams of epoxy resin (a+b) described in embodiment 2; 47 grams of phenolic resin (c+d); Inorganic filler: 560 grams of e part, 80 grams of f part; 100 grams of silicon carbide; 1.5 grams of accelerator; 6 grams of flame retardant; 4.5 grams of coupling agent KH-560; 3 grams of colorant carbon black; 3 grams of release agent carnauba wax; 6 grams of silicone. After the components of the raw materials in the above formula are accurately weighed, the silicon micropowder is treated with a coupling agent in the mixer for 5 minutes, then other components are added, and melted and kneaded on a two-roll kneader at a temperature of 90 o C. The mixing time is 10 minutes. Press the mixed material into a 1.5mm thick sheet. After mixing evenly, cool and pulverize it, press it into a cake, and conduct a performance test.

experiment example 3

[0054] Experimental example 3. 92 grams of epoxy resin (a+b) described in embodiment 3; 49 grams of phenolic resin (c+d); Inorganic filler: 550 grams of e part, 100 grams of f part; 50 grams of silicon carbide; 1.5 grams of accelerator; 6 grams of flame retardant; 4.5 grams of coupling agent KH-560; 3 grams of colorant carbon black; 3 grams of release agent carnauba wax; 6 grams of silicone. After the components of the raw materials in the above formula are accurately weighed, the silicon micropowder is treated with a coupling agent in the mixer for 5 minutes, then other components are added, and melted and kneaded on a two-roll kneader at a temperature of 90 o C. The mixing time is 10 minutes. Press the mixed material into a 1.5mm thick sheet. After mixing evenly, cool and pulverize it, press it into a cake, and conduct a performance test.

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PUM

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Abstract

A high-power packaging epoxy resin composition with good forming performances contains epoxy resin (A), phenolic resin (B), inorganic filler (C), high thermal conductive filler (D), solidification accelerator (E), silane coupling agent (F), silicone (G), releasing agent (H), colorant (I) and flame retardant (J). The high thermal conductive filler selects silicon carbide which has a thermal conductive coefficient of 83.6W / m-K. The epoxy resin composition is treated by adding the silicone with epoxy group, and the melt viscosity of the obtained composition is 50-80Pa s. The high-power packaging epoxy resin composition with the good forming performances has the advantages that the epoxy resin composition has good mobility and operating performance, so that problems of incomplete filling, poor operability and the like can be solved, and requirements of packaging clients on product packaging processes and high-power packaging heat radiation can be met.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a high-power encapsulation epoxy resin composition with good molding performance. Background technique [0002] At present, high-power device packaging requires high heat dissipation performance of materials. The existing technology mainly adds high thermal conductivity inorganic fillers (such as silicon carbide, aluminum oxide, etc.) to the epoxy resin composition, which can give the composition good thermal conductivity (for example, refer to Japanese Patent Application Publication No. 6-200124). However, if the filling amount of high thermal conductivity material is too high, it will cause various problems such as reduced fluidity, which will lead to problems such as incomplete filling and poor operability in the subsequent packaging molding process. [0003] Among the disclosed technologies, surface treatment of inorganic fillers with silane coupling agents is used to increase t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08L83/06C08K13/06C08K9/06C08K3/36C08K3/34C09K3/10
Inventor 张德伟单玉来孙波周佃香王松松
Owner JIANGSU ZHONGPENG NEW MATERIAL
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