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Method for producing heat-shielding ply structure, heat-shielding ply structure, and transparent laminate film for ply structure

A technology of transparent layer and laminated layer, applied in the direction of chemical instruments and methods, coatings, layered products, etc., to achieve the effect of reducing cost, inhibiting diffusion, and excellent mass production.

Inactive Publication Date: 2014-08-27
SUMITOMO RIKO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It is described in PTL 2 that although the film allows electric waves to pass through grooves having a width of about 50 μm, when the groove width is too small, the heat-insulating film becomes an electrical continuum because the current jumps over the gap of the groove by a displacement current

Method used

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  • Method for producing heat-shielding ply structure, heat-shielding ply structure, and transparent laminate film for ply structure
  • Method for producing heat-shielding ply structure, heat-shielding ply structure, and transparent laminate film for ply structure
  • Method for producing heat-shielding ply structure, heat-shielding ply structure, and transparent laminate film for ply structure

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Embodiment

[0168] A description of the present invention will now be specifically provided with reference to Examples.

[0169] 1. Production of transparent laminated film (with grooves)

[0170] Each transparent laminated film according to the embodiment includes a 7-layer laminated layer structure part. In each of the 7-layer laminated layer structures, the following layers are laminated layer by layer on one easy-adhesive layer of a PET film having easy-adhesive layers on both sides: Formed by a sol-gel method and UV irradiation TiO 2 Layer (1st layer) | Layer (2nd layer) formed by post-oxidizing the unit of metal Ti layer / Ag-Cu alloy layer / metal Ti layer | TiO formed by sol-gel method and ultraviolet irradiation 2 Layer (3rd layer) | Layer (4th layer) formed by post-oxidizing the unit of metal Ti layer / Ag-Cu alloy layer / metal Ti layer | TiO formed by sol-gel method and ultraviolet irradiation 2 Layer (layer 5) | Layer formed by post-oxidizing the unit of metal Ti layer / Ag-Cu alloy...

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Abstract

Provided is a method of manufacturing a heat-insulating laminated structure having excellent solar radiation shielding properties and excellent radio wave permeability. At least one side of the transparent polymer film has a laminated layer structure formed by laminating a metal layer and a metal oxide layer containing an organic component. The transparent lamination film (12) is sandwiched between two transparent substrates (14, 14), and a metal layer for separating the metal layer on the lamination structure part is formed on the transparent lamination film (12). A groove portion having a width of 30 μm or less. Pressure is applied to join the two transparent substrates (14, 14) with the transparent laminated film sandwiched therebetween. This pressure also causes separation of the metal layer of the transparent laminate film (12) and increases the overall surface resistance value.

Description

technical field [0001] The present invention relates to a method for producing a heat-insulating laminated structure, a heat-insulating laminated structure, and a transparent laminate film for the laminated structure, which can be suitably used as windows of building structures such as buildings and houses Glass or window panes of vehicles such as automobiles. Background technique [0002] Conventionally, as a solar radiation shielding film, a heat ray shielding film is known. As an example of a heat ray shielding film, PTL 1 discloses a multilayer film type transparent laminate film in which metal oxide layers and metal layers are alternately laminated on one side of a transparent polymer film. [0003] In addition, PTL 2 discloses a technology in which, in heat ray reflective glass formed by laminating a film having high heat ray reflectivity on a glass base material, the surface resistance of the film is 500 Ω / □ or less, and division grooves are formed on the film , The...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B9/00B32B3/10B32B15/08C03C27/12
CPCY10T428/24479Y10T156/1082Y10T428/24612B32B17/10229Y10T428/31678B32B17/10036Y10T156/10B32B17/10761G02B5/282G02B2207/109B32B17/10005B32B2367/00B32B15/08B32B9/00B32B3/10C03C27/10
Inventor 稻垣宏树竹内哲也楢崎彻司犬塚正隆后藤修
Owner SUMITOMO RIKO CO LTD
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