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Multi-waveband output pulse plating method

A pulse electroplating, multi-band technology, applied in electrical components, printed circuits, printed circuit manufacturing, etc., can solve the problems of scrapped PCB boards, unable to meet the thickness uniformity deep plating ability, increase production costs, etc., to ensure thickness uniformity. Effect

Active Publication Date: 2015-06-17
东莞市若美电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing electroplating methods for PCB boards generally adopt DC electroplating or pulse electroplating with a single waveform, but this electroplating method cannot satisfy the thickness uniformity of electroplated copper in the holes of high-thickness-diameter ratio PCB boards and the deep plating ability of the holes. , PCB boards with high thickness-to-diameter ratio often have multiple apertures. The existing electroplating methods cannot satisfy the thickness uniformity and deep plating ability of PCB boards with different apertures. If the thickness of electroplated copper and the deep plating ability Failure to meet the requirements will lead to the scrapping of PCB boards in batches, wasting manpower and material resources, and increasing production costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Wherein, the specific parameters of the step C are: the number of segments of the pulse electroplating band is 2 segments; the first segment: the current density is 28ASF, the electroplating time is 20min, the positive and negative current ratio is 1:2.5, and the positive and negative time ratio is 20: 1; The second paragraph: the current density is 28ASF, the plating time is 40min, the positive and negative current ratio is 1:3.5, and the positive and negative time ratio is 20:1.

[0030] Table 1 compares the results of single waveform pulse electroplating and the two-band combination waveform pulse electroplating results of Example 1:

[0031]

[0032] Table 1 (plate thickness: between 2.0-3.5mm, thickness-to-diameter ratio: ≤10:1)

[0033] It can be seen from Table 1 that the electroplating effect of two-band combined waveform pulse plating is better than that of single waveform pulse electroplating. The deep plating ability of single waveform pulse electroplating...

Embodiment 2

[0035] Wherein, the specific parameters of the step C are: the number of segments of the pulse electroplating band is 3; the first segment: the current density is 22ASF, the electroplating time is 15min, the positive and negative current ratio is 1:2, and the positive and negative time ratio is 20: 1; the second paragraph: the current density is 22ASF, the plating time is 80min, the positive and negative current ratio is 1:3.5, the positive and negative time ratio is 20:1; the third paragraph: the current density is 22ASF, the plating time is 25min, the positive and negative The current ratio is 1:3, and the positive and negative time ratio is 20:1.

[0036] Table two is the comparison of the results of single waveform pulse electroplating and the three-band combination waveform pulse electroplating of embodiment two:

[0037]

[0038] Table 2 (plate thickness: between 3.5-4.5mm, thickness-to-diameter ratio: ≤12:1)

[0039] It can be seen from Table 2 that the electroplati...

Embodiment 3

[0041] Wherein, the specific parameters of the step C are: the number of segments of the pulse electroplating band is 4; the first segment: the current density is 20ASF, the electroplating time is 5min, the positive and negative current ratio is 1:1, and the positive and negative time ratio is 20: 1. The second paragraph: the current density is 20ASF, the plating time is 80min, the forward and reverse current ratio is 1:3.8, and the forward and reverse time ratio is 40:2; the third paragraph: the current density is 20ASF, the plating time is 40min, the forward and reverse The current ratio is 1:3, the positive and negative time ratio is 20:1; the fourth stage: the current density is 20ASF, the plating time is 15min, the positive and negative current ratio is 1:2, and the positive and negative time ratio is 20:1.

[0042] Table three compares the results of single waveform pulse electroplating and the four-band combination waveform pulse electroplating results of embodiment thre...

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Abstract

The invention belongs to the technical field of plating of PCBs (Printed Circuit Board), and in particular to a multi-waveband output pulse plating method which comprises the following steps of: A, selecting a plating solution according to the thickness, the pore diameter and the thickness-diameter ratio of a PCB; B, setting multiple groups of pulse plating parameters, wherein the multiple groups of pulse plating parameters respectively correspond to corresponding plating wavebands; and C, selecting the corresponding pulse plating parameter according to the PCB for plating in the plating solution, wherein each pulse plating parameter comprises current density, plating time, positive and negative current ratio, and positive and negative time ratio, and the quantity of bands of the multi-band output pulse plating is 2-6. In different plating wavebands, through setting different current densities, positive and negative current ratios and positive and negative time ratios, and matching with corresponding plating solution, the thickness uniformities and the deep plating capacities of plating copper in holes of the PCB with high thickness-diameter ratio are basically consistent, and the thickness uniformities of plating copper in different holes are ensured.

Description

technical field [0001] The invention belongs to the technical field of electroplating of PCB boards, and in particular relates to a multi-band output pulse electroplating method. Background technique [0002] With the development of PCB board technology, the current PCB board tends to be large in size, high in layers, high in thickness, high in thickness to diameter ratio, and various in diameter. Existing electroplating methods for PCB boards generally adopt DC electroplating or pulse electroplating with a single waveform, but this electroplating method cannot satisfy the thickness uniformity of electroplated copper in the holes of high-thickness-diameter ratio PCB boards and the deep plating ability of the holes. , PCB boards with high thickness-to-diameter ratio often have multiple apertures. The existing electroplating methods cannot satisfy the thickness uniformity and deep plating ability of PCB boards with different apertures. If the thickness of electroplated copper...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D5/18H05K3/18
Inventor 张文昌洪少鸿
Owner 东莞市若美电子科技有限公司
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