Manufacturing process improvement method for pluggable flexible printed circuit (FPC)

A flexible circuit board and manufacturing process technology, applied in the direction of printed circuit manufacturing, printed circuit, electrical components, etc., to improve the life of the mold and the overall punching efficiency, and ensure the effect of electrical connection performance

Active Publication Date: 2013-01-16
厦门爱谱生电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There are certain defects in the flexible circuit board with plug-in connection realized by the existing conventional manufacturing process. Therefore, it is necessary to improve the conventional manufacturing process of the flexible circuit board with plug-in connection

Method used

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  • Manufacturing process improvement method for pluggable flexible printed circuit (FPC)
  • Manufacturing process improvement method for pluggable flexible printed circuit (FPC)
  • Manufacturing process improvement method for pluggable flexible printed circuit (FPC)

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Embodiment Construction

[0029] The present invention will be further described in conjunction with the accompanying drawings and specific embodiments.

[0030] refer to figure 1 What is shown is a structure of a flexible circuit board (that is, a flexible circuit board with plug-in finger pads) that adopts plug-in connection. A conductive metal layer 2 is formed on a flexible insulating substrate 1, and the conductive metal layer 2 extends out of the flexible insulating substrate 1 , and a treated surface layer is plated on the extended conductive metal layer, thereby forming an insertion finger pad 21 . Generally, the conductive metal layer 2 is also covered with a solder resist layer 3 to protect the conductive metal layer 2 from being damaged during soldering. And on the back of the insertion finger pad 21, a reinforcing sheet 5 is bonded through the glue 4, and the physical strength of the insertion finger pad 21 is strengthened through the reinforcing sheet 5.

[0031] Figure 2a and Figure...

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PUM

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Abstract

The invention relates to the field of FPC (flexible printed circuit) manufacturing, and relates to a manufacturing process improvement method for a pluggable FPC. The manufacturing process improvement method comprises the manufacturing steps of designing a circuit; forming the circuit; stamping a positioning target; carrying out surface processing and an electrical property test on the circuit; punching the shape of the circuit out; and carrying out detection on a finished product. The manufacturing process improvement method has improvements that in the circuit design, the edges of the shapes of a pluggable finger soldering pan and the FPC are in inward contraction design, a target center of a positioning design target of the pluggable finger soldering pan is stamped to be positioned on a same surface with the pluggable finger soldering pan, and more than two mould positioning holes are adjacent to the pluggable finger soldering pan; in the positioning target stamping, the target center of the positioning target is positioned on the same surface with the pluggable finger soldering pan, and then the positioning target is stamped; and in the shape punching, the punching is carried out twice, wherein the partial shape of the region of the pluggable finger soldering pan is firstly punched, and the partial shape of the other region of the pluggable finger soldering pan is then punched. The manufacturing process improvement method of the pluggable FPC is used for manufacturing pluggable FPCs with favorable pluggable electricity performance.

Description

technical field [0001] The invention relates to the field of FPC (flexible circuit board) manufacturing, in particular to the improvement of the manufacturing process of a flexible circuit board (flexible circuit board with plug-in finger pads) that adopts plug-in connection. Background technique [0002] One of the products of the flexible circuit board (FPC) is a flexible circuit board that uses a plug-in connection, that is, the flexible circuit board has a plug-in finger pad, and the plug-in finger pad on the flexible insulating substrate and the connector (Connector) plug-in to form electrical continuity. [0003] In order to ensure good electrical connection performance when plugged with the connector (Connector). There are certain defects in the plug-connected flexible circuit board realized by the existing conventional manufacturing process. Therefore, it is necessary to improve the conventional manufacturing process of the plug-connected flexible circuit board. C...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
Inventor 邹平邹春光
Owner 厦门爱谱生电子科技有限公司
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