Earphone socket

Abstract

The invention discloses an earphone socket. The earphone socket comprises an insulating matrix, a plurality of signal terminals and a grounding terminal, wherein the insulating matrix is provided with a jack; the outer port of the jack is provided with a grounding jack electrostatic discharge member; the plurality of signal terminals are respectively arranged in the jack; and the grounding terminal is arranged in the jack. According to the earphone socket of the embodiment, the jack is provided with the jack electrostatic discharge member, so that the earphone socket has the electrical connection function and the electrostatic protection function, can effectively prevent static electricity on the earphone jack from entering the electronic product to cause damage, and the voice frequency noise is reduced.

Description

technical field [0001] The invention relates to a socket, in particular to an earphone socket of an electronic product. Background technique [0002] Headphone sockets are widely used in various electronic products, such as mobile phones, MP3, Walkman, radios and so on. The headphone socket is used to connect the headphone to the interface of the audio circuit of the electronic product, so it is easy to become the gateway for static electricity to enter the whole machine. There are other radio systems in many electronic products, such as cellular radio systems in mobile phones. These radio systems load high-frequency currents on the earphone wires by induction or conduction. These high-frequency currents enter the audio system of electronic products and pass through Demodulation of semiconductors or nonlinear components can generate audio noise that can affect the audio performance of electronic products. [0003] A ground terminal is usually provided in the jack of a conv...

AI Technical Summary

Problems solved by technology

[0007] First of all, the increased ESD / EMI components will increase the cost, the increased cost includes the component itself, the procurement of components, logistics and welding costs;

[0008] Secondly, the added ESD / EMI components will occupy valuable layout space of the circuit board. Under the requirement of miniaturization of electronic products, the layout area of ​​the circuit board is particularly precious, which is very obvious in the design of smart phones;

[0009] Third, the added ESD components are often a distance away from the headphone socket, which will cause the ESD current to generate a current loop in the electronic product, reducing the ESD protection capability;

[0010] Fourth, the increased ESD protection components will form a large inductance due to the placement position on the circuit board, which will greatly reduce the ESD protection effect

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