A packaging structure and packaging method for an organic electroluminescent device
A technology of electroluminescent devices and packaging structures, applied in the direction of electric solid devices, electrical components, semiconductor devices, etc., can solve the problems of temperature rise of organic light-emitting materials, achieve the effect of improving the yield rate and avoiding excessive heating temperature
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0036] Example 1 Preparation process of packaging structure of organic electroluminescent device
[0037] Step (1): Prepare the ITO electrode layer 3 on the substrate 1 by DC magnetron sputtering coating method;
[0038] Step (2): Prepare an ITO electrode insulating layer 4 on the sealing area of the ITO electrode layer 3 by radio frequency magnetron sputtering coating method;
[0039] Step (3): Prepare the transition layer 7 at the sealing area of the frame of the substrate 1 and the cover plate 2 by electron beam evaporation or vacuum evaporation;
[0040] Step (4): coating the sealing layer 8 on the surface of the transition layer 7 of the substrate 1 and the cover plate 2 by thermal coating or printing;
[0041] Step (5): Put the substrate 1 and the cover 2 coated with the sealing layer 8 into a heating chamber, and heat the substrate 1 and the cover 2; the maximum heating temperature reaches 10-20°C above the melting point of the sealing layer 8 , so that the surf...
Embodiment 2
[0043] Example 2 Encapsulation steps of organic electroluminescent devices
[0044]Step (1): In a vacuum environment, move the substrate 1 and the cover 2 into a vacuum glove box, and then fill the glove box with high-purity nitrogen or high-purity inert gas; seal the substrate 1 and the cover 2 The joints are aligned face to face and stacked on a platform in the glove box, and a weight is pressed on the stacked substrate 1 and cover 2; the weight of the weight should reach the sealing layer of the substrate 1 and cover 2 8 The pressure on the contact surface is 1-2kg / cm 2 .
[0045] Step (2): Connect a DC or AC power supply whose output voltage or output current can be adjusted to the two lead-out terminals 16 of the resistance heating layer 5, adjust the current flowing in the resistance heating layer, and make the temperature of the sealing layer 8 reach The temperature of the sealing layer 8 is 10-20° C. above the melting point temperature, and then kept for 20-30 minu...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More