Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-thermal-conductivity and high-heat-dissipation LED lamp

A technology of LED lamps and high heat dissipation, which is applied in the direction of semiconductor devices, lighting and heating equipment, semiconductor devices of light-emitting elements, etc., can solve the problems of low light efficiency, light loss, high heat generation, etc., to improve lighting brightness, improve efficiency, The effect of improving cooling efficiency

Inactive Publication Date: 2014-12-10
武威荣宝光电新能源发展有限公司
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] (2) In existing LED lamps, each LED chip will reflect and block each other, which will easily cause light loss, resulting in low light efficiency and high heat generation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-thermal-conductivity and high-heat-dissipation LED lamp
  • High-thermal-conductivity and high-heat-dissipation LED lamp
  • High-thermal-conductivity and high-heat-dissipation LED lamp

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0058] Combine below Figure 2 to Figure 18 , the present invention is further described:

[0059] like figure 2 As shown, a first layer of film 81 corresponding to the fixing position of the LED chip and the fixing position of the chip support is pasted on the top of the cover plate 10 on the temperature equalizing plate 1 . Next, an insulating layer 82 is formed by coating a layer of insulating medium with high thermal conductivity on other areas of the cover plate 10 on the vapor chamber. The insulating layer 82 is used to form a circuit layer.

[0060] like image 3 shown, followed by figure 2 A second layer of film 83 is then pasted on the surface. The circuit reserved position is exposed on the second layer of film 83, which is used as a circuit conduction contact when the subsequent LED chips are packaged.

[0061] Next, a layer of copper is sputtered on the surface, and finally the second layer of film 83 and the first layer of film 81 are removed, that is, the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a high-thermal-conductivity and high-heat-dissipation LED (Light Emitting Diode) lamp and a manufacture method thereof. The LED lamp comprises a constant-temperature plate, wherein a support body inside the constant-temperature plate comprises a plurality of honeycomb unilateral laminar sheets; each honeycomb unilateral laminar sheet comprises a plurality of grooves and a plurality of connection parts; the transition of every two grooves is achieved by the connection part; every two unilateral laminar sheets form a honeycomb hole by the fixed connection of the connection parts or the fixed connection of the bottoms of the grooves; and a plurality of liquid passing holes are formed in each honeycomb unilateral laminar sheet so as to enable one liquid passing hole to be formed between two adjacent honeycomb holes. According to the invention, as the plurality of liquid passing holes are formed in each honeycomb unilateral laminar sheet to enable one liquid passing hole to be formed between the two adjacent honeycomb holes, when the working fluid is injected, uneven liquid, caused by the obstruction of the honeycomb unilateral laminar sheet, in the constant-temperature plate can be omitted, and the injection efficiency is greatly improved at the same time.

Description

technical field [0001] The invention relates to an LED lamp, in particular to an LED lamp with high thermal conductivity and high heat dissipation. Background technique [0002] The popularity of LED lighting applications is a trend, and its technology lies in the system integration of light, machinery, electricity, and heat. The integrated packaged light source has the advantages of small light-emitting area, easy assembly and low cost, but its disadvantage is that it requires high heat dissipation. Heat dissipation is related to the luminous efficiency and life of the LED light source chip. The common quality problem of LED lamps is that the heat dissipation treatment is not ideal, causing serious light decay of the chip, thereby shortening the life of the light source chip. In addition, heat also adversely affects the phosphors that generate white light, which is also detrimental to luminous efficiency. [0003] In the assembly of LED lamps, the contact surfaces of each...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/64H01L33/62F21S2/00F21Y101/02F21K9/20F21Y115/10
Inventor 殷逢宝
Owner 武威荣宝光电新能源发展有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com