Substrate type light-emitting diode (LED) integrated packaging method

Abstract

The invention provides a substrate type light-emitting diode (LED) integrated packaging method. The substrate type LED integrated packaging method comprises the following steps: 1) an insulated substrate and a metal sheet are selected, and glass transition temperature of the insulated substrate is at least 180 DEG C; 2) the insulated substrate is provided with an installation through hole, and the metal sheet is fixed in the installation through hole; 3) the front face and the back face of the insulated substrate are respectively provided with coatings; 4) a chip is fixed on the metal sheet; 5) a bonding wire is welded on the coating of the front face of the insulated substrate; and 6) the chip is molded in a mold pressing method, and a substrate type LED is obtained after solidification. According to the substrate type LED integrated packaging method, a substrate is changed, the mold pressing method is adopted for molding, molding of the chip is quickened, and therefore integrated packaging of the substrate type LED is quickened, and integrated packaging efficiency of the substrate type LED is improved.

Description

technical field [0001] The present invention relates to the technical field of substrate-type chip packaging, and more specifically, to an integrated packaging method for substrate-type LEDs. Background technique [0002] At present, in substrate-type LED integrated packaging technology, in order to achieve higher power with a smaller area, COB (Chip On Board, COB, chip-on-board packaging) integrated packaging is usually used. The general process of COB packaging is: [0003] Apply the dam glue on the COB substrate; bake the dam glue; after the dam glue is baked, apply the encapsulation glue; bake the encapsulation glue. [0004] Among them, the purpose of dispensing the dam glue is to prevent the encapsulation glue from flowing out of the COB substrate. Therefore, COB encapsulation requires two dispensing of glue and two times of baking glue, so the encapsulation time required for COB encapsulation is longer and the encapsulation efficiency is lower; Moreover, the product...

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Problems solved by technology

[0004] Among them, the purpose of dispensing the dam glue is to prevent the encapsulation glue from flowing out of the COB substrate. Therefore, COB encapsulation requires two dispensing of glue and two times of baking glue, so the encapsulation time required for COB encapsulation is longer and the encapsulation efficiency is lower; Moreover, the production efficiency of the existing COB packaging dam dispensing machine is relatively low, which further prolongs the packaging time required for COB packaging, resulting in low packaging efficiency of COB packaging, making the integrated packaging efficiency of substrate-type LEDs low.

[0005] In addition, COB substrates are mostly ceramic substrates, because ceramic substrates have high thermal conductivity, but ceramic substrates are relatively brittle, especially for the cutting process, which makes the efficiency of the ceramic substrate cutting process low, resulting in the integrated packaging efficiency of substrate-type LEDs. Low; and the cost of the ceramic substrate is high, making the cost of integrated packaging of substrate-type LEDs relatively high

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