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High thermal conductivity and low viscosity water base composite heat conductivity filler nanofluid and preparation method thereof

A technology of thermally conductive fillers and nanofluids, which is applied in the field of low viscosity water-based nanofluids containing composite thermally conductive fillers and high thermal conductivity to achieve high thermal conductivity.

Inactive Publication Date: 2013-02-27
SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But so far, there is no relevant literature or patent report on the preparation method of water-based graphene-containing carbon nanotube composite thermally conductive filler nanofluid.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Preparation of 12-3-12 with a mass content of 0.1%, 2Br -1 Aqueous solution, the composite thermally conductive filler with a total volume fraction of 0.01% and 12-3-12 with a volume fraction of 99.99%, 2Br -1 The aqueous solution was mixed and ultrasonically vibrated for about 10 hours. The mass ratio of single-layer graphene and single-walled carbon nanotubes milled for 5 hours in the composite heat-conducting filler is 3:7. The formed nanofluid is stable for 5 hours, and its thermal conductivity is 6.6% higher than that of water.

Embodiment 2

[0023] Preparation of 12-3-12 with a mass content of 0.2%, 2Br -1 Aqueous solution, the composite thermally conductive filler with a total volume fraction of 0.01% and 12-3-12 with a volume fraction of 99.99%, 2Br -1 The aqueous solution was mixed and ultrasonically vibrated for about 10 hours. The mass ratio of single-layer graphene and single-walled carbon nanotubes milled for 5 hours in the composite heat-conducting filler is 1:1. The formed nanofluid is stable for 8 hours, and its thermal conductivity is 10.3% higher than that of water.

Embodiment 3

[0025] Preparation of 12-3-12 with a mass content of 0.2%, 2Br -1 Aqueous solution, the composite thermally conductive filler with a total volume fraction of 0.01% and 12-3-12 with a volume fraction of 99.99%, 2Br -1 The aqueous solution was mixed and ultrasonically vibrated for about 10 hours. The mass ratio of single-layer graphene and single-walled carbon nanotubes milled for 5 hours in the composite heat-conducting filler is 7:3. The formed nanofluid is stable for 24 hours, and its thermal conductivity is 16.8% higher than that of water.

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Abstract

The invention provides a high thermal conductivity and low viscosity water base composite heat conductivity filler nanofluid and a preparation method thereof. The nanofluid comprises, by volume, 0.01-0.2 part of composite heat conductivity fillers and 99.8-9.99 parts of aqueous solutions. When the total volume share of the composite heat conductivity fillers is 0.015%, the obtained nanofluid heat conductivity coefficient is raised to 54%. Compared with viscosity of water, the obtained nanofluid viscosity is almost not changed. By means of the method, the prepared nanofluid containing the composite heat conductivity fillers has the advantages of being high in heat conductivity, low in viscosity and good in dispersity and stability, and the nanofluid can be actually applied to a heat exchange system.

Description

technical field [0001] The invention relates to a nanofluid, in particular to a high thermal conductivity, low viscosity water-based nanofluid containing composite thermal conductivity fillers. Background technique [0002] With the development of the electronics industry in the direction of high performance, miniaturization, and integration, the requirements for high-efficiency, low-resistance, and compact performance indicators of the heat exchange system are also getting higher and higher, and the problem of heat dissipation is becoming more and more acute, which has become a factor affecting its development. a bottleneck. For example, LED is a new generation of green light source and lighting technology. However, a major factor restricting the development of high-power LED is poor heat dissipation, which seriously affects its reliability and life. In addition, in the fields of energy, chemical industry, aerospace and other fields, higher requirements are put forward for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/10
Inventor 陈立飞于伟谢华清
Owner SHANGHAI SECOND POLYTECHNIC UNIVERSITY
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