Component substrate and manufacture method thereof

Abstract

A fabricating method of a device substrate including the following procedures is provided. First, a substrate is provided and a patterned structure is formed on the substrate, wherein the patterned structure includes a plurality of openings. Then, a protective layer is formed on the patterned structure, wherein the protective layer does not fully fill the openings of the patterned structure such that a gap is existed between the protective layer and the patterned structure. Later, a device layer is formed on the protective layer.

Description

technical field [0001] The present invention relates to a substrate and its manufacturing method, and in particular to an element substrate and its manufacturing method. Background technique [0002] In order to possess the characteristic of flexibility, flexible substrates such as plastic substrates or polymer substrates are often used instead of glass substrates for flexible display elements. Due to the poor chemical resistance of the flexible substrate, it is easy to be damaged during the etching process. Therefore, an additional dielectric protection layer (protection layer) is usually required to avoid device damage. The dielectric protection layer can be silicon oxide, aluminum oxide or Inorganic material dielectric layer such as silicon nitride. [0003] In addition to the function of protecting the flexible substrate, these dielectric layers of inorganic materials also have the function of blocking moisture and oxygen. For example, when the subsequent application c...

AI Technical Summary

Problems solved by technology

Whether it is compressive stress or tensile stress, when the flexible substrate is removed from the glass slide, it may cause the flexible substrate to bend and deform, which increases the risk of subsequent component disconnection or yellow light process misalignment.

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