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Dual-interface card packaging method

A packaging method and dual-interface card technology, applied to record carriers, instruments, and electrical components used in machines, can solve problems such as affecting quality and restricting efficiency, avoiding oxidation or welding at solder joints, simplifying process links, The effect of reducing process steps

Inactive Publication Date: 2015-06-10
包邦枝
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to simplify the packaging process of the dual-interface card, which can not only ensure the tight welding of the chip and the antenna joint, but also realize the welding and sealing at one time, and overcome the problems that the welding and sealing processes affect the quality and restrict the efficiency of each other

Method used

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Embodiment Construction

[0016] Figure 1 to Figure 5 Shown is a preferred embodiment of the invention. figure 1 Shown is a card body 1 with a slot already milled. There is already an antenna in the card body 1. The slot is divided into an inner slot 201 and an outer slot 202. The area of ​​the outer slot is larger than the area of ​​the inner slot. You can mill the slot first The outer groove 202 is milled after the inner groove 201, or the outer groove 202 can be milled first, and then the inner groove 201 is milled. In this embodiment, the inner groove 201 is milled first, and then the outer groove 202 is milled. The groove that mills out is used for placing chip 9, and the size and will match with chip 9. During the groove milling process, the antenna joint 3 in the card body 1 should be exposed by milling, and the length of the exposed antenna joint 3 should be greater than 0.5 mm and less than 3.5 mm. If the antenna connector 3 is too short, it may not be in contact with the solder paste 7, an...

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Abstract

The invention discloses a dual-interface card packaging method. The packaging method comprises the following steps of: milling a groove in a card body in which an antenna is embedded, wherein when the groove is milled, an antenna terminal is exposed, and some of an insulating layer of the antenna terminal is abraded to expose an electric conduction core of the antenna, or if a metal sheet for welding is embedded in the antenna in the card body, the metal sheet is milled to be exposed when the groove is milled; synchronously, dotting tin paste on an antenna contact point of a chip to be packaged, and painting a hot melt adhesive or other cohesive materials on other places except for the antenna contact point and a center silica gel part of the chip; and then, heating the tin paste and the hot melt adhesive, and carrying out hot pressing and cold pressing on the chip in the groove milled in the card body according to a preset temperature and preset time. The packaging method provided by the invention reduces processing steps for packing a dual-interface card, and simultaneously avoids the problem of open welding caused by oxidation at a welding spot in a process of welding first and then pressing sealing.

Description

technical field [0001] This patent relates to the encapsulation process of a dual-interface card, in particular to a method for encapsulating a chip on a card body with solder paste. Background technique [0002] The use of dual-interface cards is becoming more and more widespread. At present, there are two main production processes for dual-interface cards: injection molding and lamination. The cost of injection molding is high, the productivity is low, and the price is expensive, so this process is relatively seldom used. Lamination is currently the main method for the production and processing of dual interface cards. The lamination method includes three links, one is to press the antenna into the multi-layer packaging medium to make a card body with antenna; the other is to mill out a chip-sized groove at the chip position of the card body with a milling cutter; the third is to The chip package is fixed in the groove, and the package fixing process must ensure that the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/603H01L21/56G06K19/077
Inventor 包邦枝
Owner 包邦枝
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