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Substrate-free LED (Light-Emitting Diode) lamp and preparation method thereof

A technology of LED lamps and LED lamp beads, which is applied in lighting and heating equipment, point light sources, electric light sources, etc., can solve the problems of increasing the thermal resistance of LED lamp beads and supports, complex manufacturing process, and high price, and achieves The effect of saving materials and production costs, simple production process and low production cost

Active Publication Date: 2013-03-20
SINOPLAST NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the existence of the aluminum substrate or ceramic substrate, the thermal resistance between the LED lamp bead and the support is increased, the heat dissipation effect is reduced, and the service life of the LED lamp bead is greatly shortened.
In addition, at the same time, the cost of aluminum substrates is high, the manufacturing process is complicated, and the electrical insulation performance is poor; the ceramic substrates require high-temperature sintering, the process is complex, expensive, poor mechanical properties and fragile
Therefore, the current LED lamps have complicated structure, high manufacturing cost, complicated manufacturing process and poor heat dissipation effect.

Method used

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  • Substrate-free LED (Light-Emitting Diode) lamp and preparation method thereof
  • Substrate-free LED (Light-Emitting Diode) lamp and preparation method thereof

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Embodiment Construction

[0026] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, and to analyze the advantages and spirit of the present invention, a further understanding of the present invention can be obtained through the following detailed description of the present invention in conjunction with the accompanying drawings and specific embodiments.

[0027] A substrate-less LED lamp and a manufacturing method thereof, comprising a base 10 and a plurality of LED lamp beads 20 arranged on the base 10 . The base 10 is provided with a metal coating layer a11 and a metal coating layer b12, the metal coating layer a11 forms a circuit layer for conducting the LED lamp bead 20, and the metal coating layer b12 forms a heat conduction layer. The pins 21 of the LED lamp bead 20 are welded on the metal coating a11 to form a conductive path with the metal coating a11 . The bottom of the LED lamp bead 20 is in close contact with the...

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Abstract

The invention discloses a substrate-free LED (Light-Emitting Diode) lamp and a preparation method thereof. The substrate-free LED lamp comprises a base and a plurality of LED lamp beads arranged on a the base, wherein the base is provided with a metal plating a and a metal plating b; a circuit layer is formed on the metal plating a; a heat conducting layer is formed on the metal plating b; pins of the LED lamp beads are welded on the metal plating a; the LED lamp beads and the metal plating a construct a conducting circuit; and the bottoms of the LED lamp beads are tightly attached to the metal plating b, so that heat of the LED lamp beads is convenient to conduct. The substrate-free LED lamp has the advantages of simple structure and good radiating effect; the preparation method is simple and convenient; and the circuit layer and the heat conducting layer are formed on the base by adopting laser etching and electric chemical plating methods, so that the manufacturing cost is low.

Description

technical field [0001] The invention relates to the technical field of LED lamps, in particular to a substrate-free LED lamp with good heat dissipation effect and a preparation method thereof. Background technique [0002] With the development and maturity of LED technology, the indicators of LED are increasing day by day, and LED lighting products have been used more and more because of their long life, energy saving and environmental protection. The heat generated by a single LED lamp is relatively concentrated, and the heat generated is relatively large. Solving the heat dissipation problem is the key. [0003] However, at present, most LED lamps are welded on the aluminum substrate or ceramic substrate, and then the aluminum substrate or ceramic substrate is connected to the support. Therefore, there is a layer of aluminum substrate or ceramic substrate between the LED lamp beads and the support. . Due to the existence of the aluminum substrate or the ceramic substrate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/00F21V23/00F21Y101/02F21K9/20F21V29/85F21Y105/16F21Y115/10
Inventor 朱怀才陈列
Owner SINOPLAST NEW MATERIAL
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