Planar array paster-type low-energy-consumption environment-friendly high-precision packaging mould for integrated circuit
A planar array, integrated circuit technology, applied in the manufacture of circuits, electrical components, semiconductor/solid-state devices, etc., can solve problems such as large warpage, gas accumulation, and unsatisfactory filling, and achieve high production efficiency, environmental protection, and production costs. reduced effect
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[0033] The structure of the present invention will be further described below with reference to the accompanying drawings.
[0034] figure 1 , 2 , 3 shows a structural diagram of an upper mold box of a high-precision integrated circuit packaging mold.
[0035] Figure 4 , 5 , 6 shows a structural diagram of the lower mold box of a high-precision integrated circuit packaging mold.
[0036] Figure 7 It shows a mold clamping structure diagram of an upper mold box and a lower mold box of a high-precision integrated circuit packaging mold.
[0037] Figure 8 , 9 10 shows a structure diagram of an upper mold cavity of a high-precision integrated circuit packaging mold.
[0038] In the figure, an upper mold cavity 1, an upper mold injection block 2, and an upper mold positioning block 3 are installed on the upper mold box 4, and a lower mold cavity 13, a lower mold cavity block 14, and a lower mold cavity 19 are installed on the lower mold box 19. Injection block 15, lower ...
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Abstract
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![application no application](https://static-eureka.patsnap.com/ssr/23.2.0/_nuxt/application.06fe782c.png)
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