Laminating method of printed circuit board with ultra-thickness copper foil on the surface of core plate

Abstract

The invention relates to a printed circuit board, in particular to a laminating method of printed circuit board with ultra-thickness copper foil on the surface of a core plate. The laminating method includes the following steps: taking the core plate, wherein the thickness of the copper foil on the surface of the core plate is more than 140 microns, the copper foil is etched; filling prepreg powder in an etching groove on the surface of the copper foil; heating the core plate after the last step, enabling the prepreg powder to solute as well as not fall down from the etching groove; quickly cooling so as to enable the prepreg powder to be solidified and not to fall down; placing a prepreg layer on the surface of the core plate and placing a copper foil layer on the surface of the prepreg layer; and laminating the last step through a press machine. The laminating method is reasonable, and bits and pieces of prepregs are rubbed into powder shape, and the powder shaped prepregs are used to fill the etching groove. Then the prepreg layer is in press fit with the core plate, and the bits and pieces of the prepreg layer are utilized, materials are saved, and the lamination is tight, insulation performance is good. Electrical reliability of the printed circuit board is improved.

Description

technical field [0001] The invention relates to a printed circuit board, in particular to a pressing method for a printed circuit board with super-thick copper foil on the surface of a core board. Background technique [0002] The existing pressing method of printed circuit boards is to directly press the prepreg and the core board. If the copper foil on the surface of the core board is relatively thin and less than 140 microns, this direct pressing method is okay, but when the copper foil is larger than 140 microns When the line distance is small, the groove between the lines will be very deep, and it is difficult to effectively make the resin glue of the prepreg fully fill the etching groove during the pressing and heating process, especially when the line distance is small, the fluidity of the prepreg itself after heating The deterioration is extremely easy to generate voids or air bubbles between the lines, causing the printed circuit board to explode or delaminate when ...

AI Technical Summary

Problems solved by technology

[0002] The existing pressing method of printed circuit boards is to directly press the prepreg and the core board. If the copper foil on the surface of the core board is relatively thin and less than 140 microns, this direct pressing method is okay, but when the copper foil is larger than 140 microns When the line distance is small, the groove between the lines will be very deep, and it is difficult to effectively make the resin glue of the prepreg fully fill the etching groove during the pressing and heating process, especially when the line distance is small, the fluidity of the prepreg itself after heating The deterioration is very easy to produce voids or air bubbles between the lines, which will cause the printed circuit board to explode or delaminate when it is subjected to high temperature during HAL or terminal SMT

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