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Pre-coppering solution

A pre-plating copper solution technology, applied in the field of pre-plating copper solution, can solve the problems of great harm to the human body and ecological environment damage, and achieve the effect of stable solution performance, simple composition, and reliable coating combination

Inactive Publication Date: 2013-03-27
NANTONG HUIFENG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cyanide electroplating copper plating electrolyte will release highly toxic cyanide in a high-temperature working environment, which is harmful to the human body and causes serious damage to the ecological environment. Domestic companies are vigorously developing an alternative cyanide pre-plating process for cyanide-free copper pre-plating. copper

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A kind of pre-copper plating solution, this pre-copper plating solution is made up of following composition:

[0018] Copper sulfate 22g / L;

[0019] Methylene diphosphonic acid 120g / L;

[0020] Potassium citrate 8g / L;

[0021] Mixture of potassium sulfamate and potassium dithiocarbonate 0.05g / L;

[0022] The weight ratio of potassium sulfamate to potassium dithiocarbonate is 5:1.

Embodiment 2

[0024] A kind of pre-copper plating solution, this pre-copper plating solution is made up of following composition:

[0025] Copper sulfate 38g / L;

[0026] 1-Hydroxyethylidene 1.1 diphosphonic acid 135g / L;

[0027] Ammonium citrate 12g / L;

[0028] Mixture of potassium sulfamate and potassium dithiocarbonate 0.1g / L;

[0029] The weight ratio of potassium sulfamate to potassium dithiocarbonate is 10:1.

Embodiment 3

[0031] A kind of pre-copper plating solution, this pre-copper plating solution is made up of following composition:

[0032] Copper sulfate 55g / L;

[0033] Methylene diphosphonic acid 150g / L;

[0034] Sodium Potassium Tartrate 15g / L;

[0035] Mixture of potassium sulfamate and potassium dithiocarbonate 0.2g / L;

[0036] The weight ratio of potassium sulfamate to potassium dithiocarbonate is 15:1.

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PUM

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Abstract

The invention discloses a pre-coppering solution which is composed of the following components: 22-55g / L of copper sulphate, 120-150g / L of methylene diphosphonic acid or 1-hydroxyl methylene 1.1 diphosphonic acid, 8-15g / L of one of potassium citrate, ammonium citrate and sodium potassium tartrate tetrahydrate, and 0.05-0.2g / L of auxiliary. The pre-coppering solution disclosed by the invention has the advantages that cyanide is completely replaced with an organic phosphoric compound; harm to a human body and severe pollution to the environment, caused by cyanide generated in the electroplating process, are eliminated; clean production is realized; and the pre-coppering solution disclosed by the invention has the advantages of being simple in component, reliable in combination of coppered layers, steady in property and stored for a long time.

Description

technical field [0001] The invention relates to a copper preplating solution, which belongs to the technical field of surface treatment electroplating. Background technique [0002] The cyanide electroplating copper electrolyte uses sodium cyanide or potassium cyanide as a complexing agent for copper ions. CN and monovalent copper ions in the electrolyte form a stable complex for electrodeposition. The composition of the plating solution is simple and easy to maintain. , the coating has good adhesion and will not replace copper. Therefore, the cyanide electroplating copper electrolyte is widely used in electroplating copper for steel, aluminum, magnesium, zinc, titanium and their alloys in China. However, the cyanide electroplating copper plating electrolyte will release highly toxic cyanide in a high-temperature working environment, which is harmful to the human body and causes serious damage to the ecological environment. Domestic companies are vigorously developing an alt...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/38
Inventor 陈键
Owner NANTONG HUIFENG ELECTRONICS TECH