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Copper-ring-free double-interface smart card packaging framework

A dual-interface, intelligent technology, applied in the field of electronic information, can solve the problems of tight and unsightly arrangement of conductive wires 5, cumbersome design, waste of materials, etc., achieve convenient and beautiful product design, concise and clear functional areas, and reduce the possibility of short circuit Effect

Active Publication Date: 2013-04-03
新恒汇电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The arrangement of conductive wires 5 is relatively tight and unsightly, and the design is cumbersome, and the actual processing is difficult. Since the gold wire 10 needs to pass through the chip carrying surface 9 and the soldering hole 6, it is easy to short-circuit with the copper ring 8 on the edge and become a waste product.
The electroplating area is very large, which increases the cost, and the copper ring 8 and most of the conductive wires 5 have no practical effect, wasting materials in vain

Method used

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  • Copper-ring-free double-interface smart card packaging framework
  • Copper-ring-free double-interface smart card packaging framework
  • Copper-ring-free double-interface smart card packaging framework

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Embodiment Construction

[0021] Figure 1~2 It is the best embodiment of the method for making the encapsulation frame of the dual-interface smart card without copper ring of the present invention, below in conjunction with the attached Figure 1~4 The present invention will be further described.

[0022] Refer to attached Figure 1~2 The present invention includes a copper-ring-free dual-interface smart card packaging frame, mainly composed of a substrate and a chip bearing surface at the center of the substrate, and the substrate includes a base layer 1, a first contact layer 2 and a second contact layer 3.

[0023] Chip 4, conductive wire 5, welding hole 6, welding block 7, chip bearing surface 9, wire 10, base layer 1 is the middle layer, made of epoxy resin material, base layer 1 surrounds chip bearing surface 9 and welding hole 6, the first The contact layer 2 is coated on the front side of the base layer 1, and the second contact layer 3 is coated on the reverse side of the base layer 1. The ...

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PUM

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Abstract

A copper-ring-free double-interface smart card packaging framework belongs to the technical field of electronic information, comprises a substrate and a chip bearing surface (9) arranged at the center of the substrate and is characterized in that the substrate comprises a base layer (1), a first contact layer (2) and a second contact layer (3). The base layer (1) is a middle layer and surrounds the chip bearing surface (9) and a soldering hole (6). The first contact layer (2) is wrapped on the front side of the base layer (1), the second contact layer (3) is wrapped on the reverse surface of the base layer (1), the soldering hole (6) is arranged on the second contact layer (3), and soldering blocks (7) and conductive wires (5) connected with the soldering blocks (7) are distributed on the surface of the second contact layer (3). The chip bearing surface (9) is respectively connected with the first contact layer (2) and the second contact layer (3) through a lead wire (10) in welding mode. Compared with the prior art, the copper-ring-free double-interface smart card packaging framework is not provided with a copper ring or a conductive wire connected with the copper ring, and accordingly has the advantages of saving materials, reducing cost, being simple and convenient in structure, reasonable and the like.

Description

technical field [0001] The copper-ring-free double-interface smart card packaging frame belongs to the field of electronic information technology, and is mainly for the production of IC products. Background technique [0002] Smart card is also called IC card (Integrated Circuit Card, integrated circuit card), smart card (intelligent card), microcircuit card (microcircuit card) or microchip card, etc. It is made into a card form by embedding a microelectronic chip in a card base conforming to the ISO 7816 standard. Smart card is another new type of information tool after magnetic card. Common smart cards use radio frequency technology to communicate with card readers. It successfully solves the problem of passive (no power supply in the card) and contact-free, which is a major breakthrough in the field of electronic devices. It is mainly used in the automatic toll collection system of buses, ferries, and subways, and is also used in access control management, identity ver...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/07
Inventor 何玉凤邵汉文于艳晏秀梅
Owner 新恒汇电子股份有限公司
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