Copper-ring-free double-interface smart card packaging framework
A dual-interface, intelligent technology, applied in the field of electronic information, can solve the problems of tight and unsightly arrangement of conductive wires 5, cumbersome design, waste of materials, etc., achieve convenient and beautiful product design, concise and clear functional areas, and reduce the possibility of short circuit Effect
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[0021] Figure 1~2 It is the best embodiment of the method for making the encapsulation frame of the dual-interface smart card without copper ring of the present invention, below in conjunction with the attached Figure 1~4 The present invention will be further described.
[0022] Refer to attached Figure 1~2 The present invention includes a copper-ring-free dual-interface smart card packaging frame, mainly composed of a substrate and a chip bearing surface at the center of the substrate, and the substrate includes a base layer 1, a first contact layer 2 and a second contact layer 3.
[0023] Chip 4, conductive wire 5, welding hole 6, welding block 7, chip bearing surface 9, wire 10, base layer 1 is the middle layer, made of epoxy resin material, base layer 1 surrounds chip bearing surface 9 and welding hole 6, the first The contact layer 2 is coated on the front side of the base layer 1, and the second contact layer 3 is coated on the reverse side of the base layer 1. The ...
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